AM3352BZCZ100Alternatives & Equivalent Parts
About AM3352BZCZ100
AM3352BZCZ100 is a Integrated Circuit component manufactured by Texas Instruments. It comes in a BGA package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | AM3352BZCZ100Source | AT91SAM9G25-CU | ATSAMA5D225C-D1M-CU | ATSAMV70N19B-AAB | AM3352BZCZA100 | AM3352BZCZA80 | AM3352BZCZT60 | AM3352BZCZ30 | AM3352BZCZD60 |
|---|---|---|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Microchip | Microchip | Microchip | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package Type | BGA | BGA | BGA | Quad Flat Packages | BGA | BGA | BGA | BGA | BGA |
| Pin Count | 324 | 217 | 196 | 100 | 324 | 324 | 324 | 324 | 324 |
| Temperature Range | ~ 90.0°C | -40.0°C ~ 85.0°C | — | -40.0°C ~ 105.0°C | -40.0°C ~ 105.0°C | -40.0°C ~ 105.0°C | -40.0°C ~ 125.0°C | ~ 90.0°C | -40.0°C ~ 90.0°C |
| Price | $6.5971 | $6.9300 | $10.0900 | $8.6500 | $7.5870 | $9.9200 | $12.1909 | $6.2912 | $6.3284 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||||||
| YTEOL | 15 | 14 | 18 | 19 | 15 | 15 | 15 | 15 | 15 |
| Additional Feature | ALSO OPERATES AT MIN 0.912 V | MMC(2), RS-485 | — | — | ALSO OPERATES AT MIN 0.912 V | ALSO OPERATES AT MIN 0.912 V | ALSO OPERATES AT MIN 0.912 V | ALSO OPERATES AT MIN 0.912 V | ALSO OPERATES AT MIN 0.912 V |
| JESD-30 Code | S-PBGA-B324 | S-PBGA-B217 | — | S-PQFP-G100 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 | S-PBGA-B324 |
| JESD-609 Code | e1 | e1 | — | e3 | e1 | e1 | e1 | e1 | e1 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | — | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | BGA324,18X18,32 | BGA217,17X17,32 | — | QFP100,.63SQ | BGA324,18X18,32 | BGA324,18X18,32 | BGA324,18X18,32 | BGA324,18X18,32 | BGA324,18X18,32 |
| Package Shape | SQUARE | SQUARE | — | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | — | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 | — | — | — | 260 | 260 | 260 | 260 | 260 |
| Qualification Status | Not Qualified | Not Qualified | — | — | Not Qualified | Not Qualified | — | Not Qualified | Not Qualified |
| Supply Voltage-Max | 1.144 V | 1.1 V | — | 3.6 V | 1.144 V | 1.144 V | 1.144 V | 1.144 V | 1.144 V |
| Supply Voltage-Min | 1.056 V | 0.9 V | — | 3 V | 1.056 V | 1.056 V | 1.056 V | 1.056 V | 1.056 V |
| Supply Voltage-Nom | 1.1 V | 1 V | — | 3.3 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Surface Mount | YES | YES | — | YES | YES | YES | YES | YES | YES |
| Technology | CMOS | CMOS | — | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature Grade | OTHER | INDUSTRIAL | — | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | OTHER | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | — | Matte Tin (Sn) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL | BALL | — | GULL WING | BALL | BALL | BALL | BALL | BALL |
| Terminal Pitch | 0.8 mm | 0.8 mm | — | 0.5 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal Position | BOTTOM | BOTTOM | — | QUAD | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 | — | — | — | 30 | 30 | 30 | 30 | 30 |
| uPs/uCs/Peripheral ICs Type | SoC | MICROPROCESSOR, RISC | SOC | MICROCONTROLLER, RISC | SoC | SoC | SoC | SoC | SoC |
| Pbfree Code | — | Yes | — | — | — | Yes | Yes | Yes | Yes |
| Manufacturer Package Code | — | LFBGA-217 | TFBGA-196 | LQFP-100 | — | — | — | — | — |
| Factory Lead Time | — | 1 Week | 7 Weeks | 8 Weeks | — | — | — | — | — |
| Address Bus Width | — | 26 | — | 24 | — | — | — | — | — |
| Bit Size | — | 32 | — | 32 | — | — | — | — | — |
| Boundary Scan | — | YES | — | YES | — | — | — | — | — |
| Clock Frequency-Max | — | 133 MHz | — | 150 MHz | — | — | — | — | — |
| External Data Bus Width | — | 32 | — | 16 | — | — | — | — | — |
| Format | — | FIXED POINT | — | FLOATING POINT | — | — | — | — | — |
| Integrated Cache | — | YES | — | NO | — | — | — | — | — |
| Low Power Mode | — | YES | — | NO | — | — | — | — | — |
| Number of DMA Channels | — | 16 | — | 24 | — | — | — | — | — |
| Number of External Interrupts | — | 2 | — | 1 | — | — | — | — | — |
| Number of Serial I/Os | — | 7 | — | 8 | — | — | — | — | — |
| Speed | — | 400 MHz | — | 300 MHz | — | — | — | — | — |
| Date Of Intro | — | — | 2017-09-07 | — | — | — | — | — | — |
| ## ATSAMA5D225C-D1M-CU Alternates Showing results | — | — | Image | — | — | — | — | — | — |
| Has ADC | — | — | — | YES | — | — | — | — | — |
| CPU Family | — | — | — | CORTEX-M7 | — | — | — | — | — |
| DAC Channels | — | — | — | YES | — | — | — | — | — |
| DMA Channels | — | — | — | YES | — | — | — | — | — |
| Number of I/O Lines | — | — | — | 75 | — | — | — | — | — |
| Number of Timers | — | — | — | 12 | — | — | — | — | — |
| On Chip Program ROM Width | — | — | — | 8 | — | — | — | — | — |
| PWM Channels | — | — | — | YES | — | — | — | — | — |
| ROM (words) | — | — | — | 524288 | — | — | — | — | — |
| ROM Programmability | — | — | — | FLASH | — | — | — | — | — |
| Screening Level | — | — | — | AEC-Q100; TS 16949 | — | — | — | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Why Look for Alternatives?
Finding alternatives for AM3352BZCZ100 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating AM3352BZCZ100 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to AM3352BZCZ100?
Known equivalents for AM3352BZCZ100 include AT91SAM9G25-CU, ATSAMA5D225C-D1M-CU, ATSAMV70N19B-AAB. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of AM3352BZCZ100?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify AM3352BZCZ100 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.