ADRF6655ACPZ-R7 Analog Devices Integrated Circuit (Quad Flat No-Lead) In Stock
Analog Devices ADRF6655ACPZ-R7 is a broadband up/downconverting mixer IC in a 40-pin QFN package, supporting wideband RF signal conversion from 700 MHz to 2.7 GHz LO range. Suitable for cellular, microwave backhaul, and test equipment. From $15 in stock worldwide shipping.
- Manufacturer
- Analog Devices
- Package
- Quad Flat No-Lead
- Pin Count
- 40
- Lifecycle
- OBSOLETE
- Datasheet
- ADRF6655ACPZ-R7 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Broadband upconversion and downconversion supporting LO frequencies from 700 MHz to 2.7 GHz for multi-band radio designs
- High linearity mixer core enabling low IMD3 performance required in cellular base station and microwave backhaul transceivers
- 40-pin QFN (CP-40-1) package with exposed paddle providing excellent thermal dissipation for continuous RF operation
- Wideband IF and RF port bandwidth covering 5G sub-6 GHz, LTE, and microwave backhaul frequency allocations
- Integrated LO buffer reducing external component count and simplifying PCB layout in RF front-end modules
Applications
The ADRF6655ACPZ-R7 is used in cellular base station transceivers and microwave point-to-point backhaul radios where a high-linearity broadband mixer covering 700 MHz to 2.7 GHz LO frequencies is required for up and downconversion. It also serves in software-defined radio (SDR) platforms and RF test instruments that must handle wideband signal conversion across multiple frequency bands without changing hardware. Military and aerospace wideband surveillance receivers benefit from its broad tuning range and compact QFN-40 package.
Specifications
| Pbfree Code | No |
| Manufacturer Package Code | CP-40-1 |
| YTEOL | 0 |
| Analog IC - Other Type | PHASE DETECTOR |
| JESD-30 Code | S-XQCC-N40 |
| JESD-609 Code | e3 |
| Number of Functions | 1 |
| Package Body Material | UNSPECIFIED |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.25V |
| Supply Voltage-Min (Vsup) | 4.75V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A991.B |
| HTS Code | 8542.39.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What LO frequency range does the ADRF6655ACPZ-R7 support and which wireless standards does that coverage enable?
The ADRF6655ACPZ-R7 supports LO frequencies from 700 MHz to 2.7 GHz, covering LTE 700 MHz and 850 MHz bands, 2G/3G 1900 MHz and 2100 MHz bands, as well as 5G sub-6 GHz allocations and microwave backhaul frequencies up to 2.7 GHz.
What package does the ADRF6655ACPZ-R7 use and how does it handle thermal dissipation in continuous RF operation?
The ADRF6655ACPZ-R7 comes in a 40-pin QFN package with an exposed thermal pad on the bottom, allowing direct heat transfer to the PCB ground plane. This thermal paddle keeps junction temperature within limits during high-power RF conversion in base station and backhaul radio designs operating at elevated ambient temperatures.
In which RF system architectures is the ADRF6655ACPZ-R7 used as the core frequency conversion element?
The ADRF6655ACPZ-R7 is used in direct-conversion and superheterodyne transceiver architectures for cellular macro base stations, small cells, and point-to-point microwave backhaul links operating at GHz frequencies, where its broadband coverage eliminates the need for multiple band-specific mixers.
How does the integrated LO buffer in the ADRF6655ACPZ-R7 reduce external component count in RF front-end designs?
The integrated LO buffer amplifies the LO drive signal internally, so the designer does not need an external LO buffer amplifier or driver. This reduces component count by at least 2 to 3 parts, simplifies PCB routing of the sensitive LO signal, and decreases board area in high-density RF module designs.
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About Analog Devices
Analog Devices (ADI) is a global leader in high-performance analog, mixed-signal, and digital signal processing integrated circuits used in virtually all types of electronic equipment.
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