ADC1061CMJ Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock

Name: ADC1061CMJ
Brand: Texas Instruments
SKU: ADC1061CMJ
Availability: InStock

ADC1061CMJ is a 10-bit flash-method analog-to-digital converter by Texas Instruments in a 20-pin ceramic DIP package. Key specs: 1.8 µs max conversion time, -0.3 V to 6.3 V analog input range, 0.15% max linearity error. Available in stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026

Package / Visual Reference

ADC1061CMJCeramic Dual-In-Line Packages

Quick Facts

Manufacturer: Texas Instruments
Package: Ceramic Dual-In-Line Packages
Pin Count: 20
Lifecycle: OBSOLETE
Datasheet: ADC1061CMJ Datasheet PDF
Category: Integrated Circuit
Temp Range: -55.0°C to 125.0°C
RoHS: Non-compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of ADC1061CMJ?

Flash-method conversion achieving up to 1.8 µs maximum conversion time for high-speed data acquisition
10-bit resolution with 0.15% maximum linearity error for accurate analog measurement
Single-channel analog input accepting -0.3 V to 6.3 V range in a rugged 20-pin ceramic DIP package

What is ADC1061CMJ used for?

ADC1061CMJ is suited for industrial data acquisition systems and legacy test equipment requiring fast 10-bit ADC conversion within 1.8 µs. Its ceramic DIP-20 package and wide analog input range of -0.3 V to 6.3 V make it compatible with established through-hole PCB designs in defense and aerospace instrumentation. The flash conversion method also benefits real-time control loops where latency below 2 µs is critical.

What are the specifications of ADC1061CMJ?

Reach Compliance Code	Unknown
YTEOL	0
Analog Input Voltage-Max	6.3V
Analog Input Voltage-Min	-0.3 V
Conversion Time-Max	1.8 µs
Converter Type	ADC, FLASH METHOD
JESD-30 Code	R-GDIP-T20
JESD-609 Code	e0
Linearity Error-Max (EL)	0.15%
Number of Analog In Channels	1
Number of Bits	10
Number of Functions	1
Output Bit Code	OFFSET BINARY
Output Format	PARALLEL, WORD
Package Body Material	CERAMIC, GLASS-SEALED
Package Equivalence Code	DIP20,.3
Package Shape	RECTANGULAR
Package Style	IN-LINE
Qualification Status	Not Qualified
Sample and Hold / Track and Hold	TRACK
Supply Current-Max	30mA
Supply Voltage-Nom	5V
Surface Mount	NO
Technology	CMOS
Temperature Grade	MILITARY
Terminal Finish	TIN LEAD
Terminal Form	THROUGH-HOLE
Terminal Pitch	2.54mm
Terminal Position	DUAL
Package	Ceramic Dual-In-Line Packages

Compliance & Regulatory

RoHS Status	Non-compliant
Lead-Free	Yes (Pb-Free)
ECCN	3A001.a.2.c
HTS Code	8542.39.00.30

Where can I find the ADC1061CMJ datasheet?

ADC1061CMJ Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for ADC1061CMJ?

Compatible alternatives and drop-in replacements for ADC1061CMJ:

ADC1061CINTexas Instruments ADC, Flash Method,

10-Bit, 1 Func, 1 Channel, Parallel, Word Access, CMOS, PDSO20

View Part →

Compare all alternatives & request quotes →

Frequently Asked Questions

How fast is ADC1061CMJ's flash-method conversion, and which real-time applications benefit from this speed?

ADC1061CMJ completes conversion in a maximum of 1.8 µs, equivalent to a throughput rate above 500 kSPS. This makes it well suited for industrial motor-current sensing loops, power line monitoring, and ultrasonic pulse-echo systems where the ADC must capture transients within a 2 µs window. The flash architecture avoids the latency of successive approximation converters in these time-critical applications.

What is the linearity error of ADC1061CMJ, and how does it limit measurement accuracy in a sensor interface?

ADC1061CMJ specifies a maximum linearity error of 0.15%, which over a 10-bit full-scale range corresponds to roughly ±1.5 LSB of integral non-linearity. For a 5 V full-scale input this translates to about ±7.5 mV of systematic error, acceptable for general-purpose industrial temperature and pressure sensing but marginal for precision metrology requiring better than 0.1% accuracy.

Why would a designer choose ADC1061CMJ's ceramic DIP-20 package over a surface-mount ADC for a defense application?

The ceramic DIP-20 (CDIP) package offers hermetic sealing rated for harsh environments including wide temperature ranges of -55°C to +125°C and resistance to moisture, vibration, and radiation typical in military and aerospace use. Surface-mount plastic packages lack hermetic sealing, making CDIP the required package type for MIL-SPEC PCB assemblies where long-term reliability under 1,000-hour thermal cycling is mandatory.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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ADC1061CMJ Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock

What are the key features of ADC1061CMJ?

What is ADC1061CMJ used for?

What are the specifications of ADC1061CMJ?

Compliance & Regulatory

Where can I find the ADC1061CMJ datasheet?

What are equivalent replacements for ADC1061CMJ?

Frequently Asked Questions

How fast is ADC1061CMJ's flash-method conversion, and which real-time applications benefit from this speed?

What is the linearity error of ADC1061CMJ, and how does it limit measurement accuracy in a sensor interface?

Why would a designer choose ADC1061CMJ's ceramic DIP-20 package over a surface-mount ADC for a defense application?

Related Guides

STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply

STM32H725IGT3 High-Performance MCU Design Guide

150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing

STEF05SGR 5 V eFuse Protection Design Guide

Why Buy from FindMyChip

About Texas Instruments

More from Texas Instruments

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