A2F200M3F-FG256 Microchip Integrated Circuit (BGA) In Stock
The A2F200M3F-FG256 is a SmartFusion FPGA from Microchip with 200K equivalent gates, 4608 logic cells, and an integrated ARM Cortex-M3 hard processor core running at up to 100 MHz in 130 nm technology. It operates at 1.5 V core voltage and is housed in a 256-pin FBGA package with 117 user I/O pins. Suitable for embedded control, industrial automation, and communication interface bridging applications.
- Manufacturer
- Microchip
- Package
- BGA
- Pin Count
- 256
- Lifecycle
- ACTIVE
- Datasheet
- A2F200M3F-FG256 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 85.0°C
- RoHS
- Non-compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of A2F200M3F-FG256?
- 200K equivalent gates and 4608 logic cells for substantial programmable logic capacity
- Integrated ARM Cortex-M3 hard processor core at up to 100 MHz
- 130 nm flash-based FPGA process enabling instant-on power-up without external configuration memory
- 1.5 V core supply voltage for low power embedded applications
- 256-pin FBGA package with 117 user I/O pins for high connectivity designs
What is A2F200M3F-FG256 used for?
The A2F200M3F-FG256 is used in embedded control applications where both programmable logic and a hard processor are needed in a single device, such as industrial motor controllers, smart power management systems, and communication protocol bridging. Its flash-based FPGA fabric provides instant-on capability without an external configuration PROM, simplifying board design and improving system startup reliability.
What are the specifications of A2F200M3F-FG256?
| Reach Compliance Code | Compliant |
| Factory Lead Time | 12Weeks |
| YTEOL | 6.3 |
| JESD-30 Code | S-PBGA-B256 |
| Number of Equivalent Gates | 200000 |
| Number of Inputs | 117 |
| Number of Logic Cells | 4608 |
| Number of Outputs | 117 |
| Organization | 200000GATES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA256,16X16,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Programmable Logic Type | FPGA SOC |
| Supply Voltage-Max | 1.575V |
| Supply Voltage-Min | 1.425V |
| Supply Voltage-Nom | 1.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Non-compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.60 |
Where can I find the A2F200M3F-FG256 datasheet?
A2F200M3F-FG256 Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for A2F200M3F-FG256?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many user I/O pins and logic cells does the A2F200M3F-FG256 provide?
The A2F200M3F-FG256 provides 117 user I/O pins and 4608 logic cells equivalent to 200K gates in a 256-pin FBGA package. This combination of I/O count and logic density is suitable for designs requiring multiple peripheral interfaces alongside moderate programmable logic functions.
What advantage does the A2F200M3F-FG256's flash-based fabric provide over SRAM-based FPGAs at power-up?
Unlike SRAM-based FPGAs that require an external configuration PROM and a multi-millisecond loading phase on every power-up, the A2F200M3F-FG256 uses non-volatile 130 nm flash fabric that retains its configuration and begins operating immediately at power-on. This instant-on behavior is critical in safety systems and industrial equipment where control logic must be active within microseconds of power application.
When would a designer choose the A2F200M3F-FG256 over a standalone microcontroller plus separate FPGA solution?
Combining a discrete ARM Cortex-M3 microcontroller with a separate FPGA requires two power rails, two PCB footprints, and a high-speed inter-chip bus that consumes board area and adds latency. The A2F200M3F-FG256 integrates the 100 MHz ARM Cortex-M3 processor and 200K gate programmable logic fabric in a single 256-pin FBGA, reducing component count, board area, and system power while tightening the latency between the processor and the custom logic.
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