74SSTL16837ADGGRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
74SSTL16837ADGGRE4 is a 20-bit unidirectional SSTL bus driver with 3-state outputs by Texas Instruments for high-speed DDR memory interface applications. Key specs: 20 outputs, 30 pF rated load capacitance, active-low enable, 64-pin SSOP package. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 64
- Lifecycle
- OBSOLETE
- Datasheet
- 74SSTL16837ADGGRE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 74SSTL16837ADGGRE4?
- 20-bit unidirectional SSTL-2/SSTL-3 bus driver with 3-state outputs rated for 30 pF load, enabling high-speed DDR SDRAM address and command bus driving
- Active-low output enable (OE) control with matched propagation delays across all 20 outputs to minimize bus skew on parallel memory interfaces
- 64-pin SSOP (R-PDSO-G64) package with SSTL-compatible I/O thresholds for direct connection to DDR SDRAM clock and control buses without additional termination drivers
What is 74SSTL16837ADGGRE4 used for?
74SSTL16837ADGGRE4 is designed for DDR SDRAM memory bus buffering in high-performance computing, networking, and embedded systems where 20 address, command, or control signals must be driven simultaneously at SSTL voltage levels. Its 3-state outputs and active-low enable allow multiple bus drivers to share a common DDR memory bus under address multiplexing or memory module bank switching architectures. The SSTL-compatible I/O meets DDR and DDR2 JEDEC electrical standards, making it suitable for DIMM slot buffer cards and FPGA memory interface expansion boards.
What are the specifications of 74SSTL16837ADGGRE4?
| YTEOL | 0 |
| Control Type | ENABLE LOW |
| Count Direction | UNIDIRECTIONAL |
| Family | SSTL |
| JESD-30 Code | R-PDSO-G64 |
| Load Capacitance (CL) | 30pF |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.02A |
| Number of Bits | 20 |
| Number of Functions | 1 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP64,.32,20 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supply Current-Max (ICC) | 90mA |
| Prop. Delay@Nom-Sup | 4.2ns |
| Propagation Delay (tpd) | 3.2ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 3V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Trigger Type | POSITIVE EDGE |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.39.00.60 |
Where can I find the 74SSTL16837ADGGRE4 datasheet?
74SSTL16837ADGGRE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 74SSTL16837ADGGRE4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What memory bus standards does 74SSTL16837ADGGRE4 support and at what load capacitance?
74SSTL16837ADGGRE4 supports SSTL-2 and SSTL-3 stub-series terminated logic interfaces defined in JEDEC standards for DDR and DDR2 SDRAM buses. It is rated for 30 pF load capacitance per output channel, matching typical DDR memory bus stub trace capacitances. The 20 unidirectional output channels drive address and command lines at the signal levels required for DDR SDRAM clocked at up to 200 MHz bus frequency.
How does the 3-state output feature of 74SSTL16837ADGGRE4 assist in multi-bank DDR memory controller designs?
The 3-state outputs of 74SSTL16837ADGGRE4 are controlled by an active-low OE pin that places all 20 outputs simultaneously into a high-impedance state. In multi-rank DDR designs, placing one bus driver into 3-state while activating another allows different memory rank address lines to share a common set of SDRAM command pins, reducing trace count and avoiding bus contention between 2-rank or 4-rank DIMM configurations.
Can 74SSTL16837ADGGRE4 be used in an FPGA-based DDR memory interface without additional termination components?
74SSTL16837ADGGRE4 includes SSTL-compatible input thresholds referenced to VREF (typically VDDQ/2), aligning with the stub-series termination scheme used in DDR memory topologies. The device outputs drive into the 50 Ω to 60 Ω series stub resistors already present on DDR bus PCBs, eliminating the need for separate termination driver ICs. FPGA DDR PHY outputs at 2.5 V SSTL swing levels can directly feed the 74SSTL16837ADGGRE4 inputs, simplifying interface design.
What is the propagation delay matching across the 20 output channels of 74SSTL16837ADGGRE4?
74SSTL16837ADGGRE4 is designed with matched internal propagation delays across all 20 bits to minimize intra-bus skew on DDR address and command lines. Typical channel-to-channel skew is under 200 ps at the rated 30 pF load, which is within the DDR and DDR2 address setup and hold timing windows of approximately 500 ps to 1 ns. This matched delay performance prevents address decoding errors caused by unequal timing across command bits at 200 MHz bus clock.
Related Guides
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit