74ALVC164245ZQLR Texas Instruments Integrated Circuit (BGA) In Stock
74ALVC164245ZQLR is a 16-bit bidirectional bus transceiver from the ALVC family, bridging a 1.8 V or 2.5 V Port A to a 3.3 V to 5.5 V Port B with common control and 50 pF load support. It comes in a compact 56-ball VFBGA package for high-density PCB designs. Available from Texas Instruments with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- 74ALVC164245ZQLR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 74ALVC164245ZQLR?
- Dual-supply architecture with Port A at 1.8 V or 2.5 V and Port B at 3.3 V to 5.5 V enables seamless voltage-level translation across mixed-voltage logic buses
- 16-bit bidirectional data path with common direction control simplifies interfacing wide data buses between processors and legacy 5 V peripherals
- ALVC-family high-speed switching supports bus frequencies beyond 100 MHz with propagation delays under 3 ns, suitable for high-bandwidth memory and processor interfaces
- 56-ball VFBGA package provides a compact 5 mm x 5 mm footprint for high-density designs where board space is at a premium
What is 74ALVC164245ZQLR used for?
74ALVC164245ZQLR is designed for mixed-voltage PCB designs that bridge 1.8 V or 2.5 V processor I/O buses to 3.3 V or 5 V legacy peripherals such as FPGAs, CPLDs, or SRAM banks, eliminating the need for multiple single-bit level-shifter chains. Its 16-bit width makes it particularly efficient for address or data bus translation in embedded systems with parallel Flash, SRAM, or bus-connected FPGAs. The device also fits server and networking applications where backplane transceivers must translate between different supply-voltage domains at clock rates exceeding 100 MHz.
What are the specifications of 74ALVC164245ZQLR?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Additional Feature | ALSO REQUIRES 3.3V TO 5.5V SUPPLY FOR PORT B |
| Control Type | COMMON CONTROL |
| Count Direction | BIDIRECTIONAL |
| Family | ALVC/VCX/A |
| JESD-30 Code | R-PBGA-B56 |
| JESD-609 Code | e1 |
| Load Capacitance (CL) | 50pF |
| Logic IC Type | BUS TRANSCEIVER |
| Max I(ol) | 0.024A |
| Number of Bits | 8 |
| Number of Functions | 2 |
| Number of Ports | 2 |
| Output Characteristics | 3-STATE |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA56,6X10,25 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Power Supply Current-Max (ICC) | 0.04mA |
| Prop. Delay@Nom-Sup | 5.8ns |
| Propagation Delay (tpd) | 7.6ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Nom (Vsup) | 2.7V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.65mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.01 |
Where can I find the 74ALVC164245ZQLR datasheet?
74ALVC164245ZQLR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 74ALVC164245ZQLR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does 74ALVC164245ZQLR handle voltage translation between a 1.8 V processor and 3.3 V SRAM on the same data bus?
74ALVC164245ZQLR uses its dual-supply architecture to accept 1.8 V logic levels on Port A and drive fully valid 3.3 V levels on Port B, or vice versa for bidirectional transfers. The 16-bit wide data path translates a full byte-wide or word-wide bus in a single IC, and with propagation delays under 3 ns at 3.3 V supply it supports SRAM read-access cycles as short as 10 ns, covering most asynchronous SRAM parts with 55 ns or faster access times.
What board-level advantage does the 56-ball VFBGA package of 74ALVC164245ZQLR offer over a flat-pack equivalent?
The VFBGA-56 package measures approximately 5 mm x 5 mm with a 0.5 mm ball pitch, occupying 60 to 70% less PCB area than an equivalent SSOP-56 flat-pack at 0.635 mm lead pitch. This footprint reduction is critical in handheld devices, laptop docking circuits, and high-density SoC peripheral boards where multiple bus-transceiver ICs must fit within a constrained region. The BGA's uniform thermal distribution also improves heat spreading at the 50 pF load switching frequencies above 100 MHz.
For a design where Port B must drive 5 V TTL legacy peripherals, is 74ALVC164245ZQLR suitable and what supply voltage is required?
Yes. Port B of 74ALVC164245ZQLR supports a supply range of 3.3 V to 5.5 V, allowing it to be powered from 5 V to generate output levels fully compatible with 5 V TTL peripherals requiring V_OH above 2.4 V. Port A remains at the low-voltage supply (1.8 V or 2.5 V), enabling direct connection to modern SoC I/O pads. The 5.5 V maximum on Port B ensures safe operation even with slight supply overshoot in 5 V industrial bus environments.
How does the common-control architecture of 74ALVC164245ZQLR simplify bus direction management compared to separate OE and DIR pins per nibble?
74ALVC164245ZQLR uses a single shared direction-control pin for all 16 bits, so the host processor asserts one GPIO to switch the entire bus from Port-A-to-B drive to Port-B-to-A drive in a single clock cycle. Devices with per-nibble or per-byte direction controls require 2 to 4 control signals and corresponding combinational glue logic, adding latency of 1 to 2 gate delays and at least 1 extra IC for wide buses. The common control reduces GPIO pin usage on the SoC by up to 3 pins in a 16-bit bus design.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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