74AHC16373DGVRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock

74AHC16373DGVRE4 is a 16-bit transparent D-type latch with 3-state outputs, 8 mA drive capability, and 50 pF load capacitance from the AHC CMOS logic family. It captures and holds 16-bit data on dual 8-bit latch banks for bus interfacing and data buffering. Available in a 48-pin TSSOP package for high-density digital PCB designs.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
74AHC16373DGVRE4Small Outline Packages
Quick Facts
Manufacturer
Texas Instruments
Package
Small Outline Packages
Pin Count
48
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of 74AHC16373DGVRE4?

  • 16-bit transparent D-type latch with dual 8-bit banks enabling simultaneous capture of two independent data bytes in bus-oriented systems
  • AHC family 3-state outputs with 8 mA drive current for robust bus driving across multiple logic families from 2V to 5.5V
  • 48-pin TSSOP package providing 16-bit data buffering in a compact footprint for high-density embedded processor address and data bus designs

What is 74AHC16373DGVRE4 used for?

74AHC16373DGVRE4 is used in microprocessor and DSP memory bus interface circuits where 16-bit address or data lines must be latched and held while the processor advances to the next bus cycle. Its dual 8-bit latch banks allow independent byte-wide control for big-endian and little-endian memory mapping in embedded SoC designs. CPLD and FPGA I/O expansion boards also use this device to extend available parallel output lines while maintaining 3-state bus sharing with other bus masters.

What are the specifications of 74AHC16373DGVRE4?

Pbfree CodeYes
YTEOL0
FamilyAHC/VHC/H/U/V
JESD-30 CodeR-PDSO-G48
JESD-609 Codee4
Load Capacitance (CL)50pF
Logic IC TypeBUS DRIVER
Max I(ol)0.008A
Number of Bits8
Number of Functions2
Number of Ports2
Output PolarityTRUE
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeTSSOP48,.25,16
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing MethodTR
Peak Reflow Temperature (Cel)260
Prop. Delay@Nom-Sup10.5ns
Propagation Delay (tpd)16.5ns
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup)5.5V
Supply Voltage-Min (Vsup)2V
Supply Voltage-Nom (Vsup)3.3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormGULL WING
Terminal Pitch0.4mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)30
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
HTS Code8542.39.00.60

Where can I find the 74AHC16373DGVRE4 datasheet?

74AHC16373DGVRE4 Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for 74AHC16373DGVRE4?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which design requirement is most important when applying 74AHC16373DGVRE4?

74AHC16373DGVRE4 is a three-state transparent latch documented with 16-bit latch operation with 8 mA drive. Engineers should confirm this capability together with supply, timing, loading, and package requirements before committing the production schematic.

How should engineers verify that 74AHC16373DGVRE4 fits the target interface?

Application review should treat 16-bit latch operation with 8 mA drive as a defined capability of 74AHC16373DGVRE4. Verify the surrounding voltage, interface timing, thermal conditions, and PCB footprint against the official manufacturer datasheet.

What should buyers confirm before accepting production stock of 74AHC16373DGVRE4?

Procurement should preserve the exact 74AHC16373DGVRE4 ordering code and confirm the 16-bit latch operation with 8 mA drive specification, package marking, lifecycle status, and lot traceability before accepting production inventory.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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