74AHC16244DGVRE4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The 74AHC16244DGVRE4 is a 16-bit non-inverting buffer and line driver with dual output-enable control and 3-state outputs in a 48-pin SSOP package. It operates from 2 V to 5.5 V and provides 8 mA output drive per channel for high-speed bus driving in AHC-family logic systems. Available from stock worldwide with tape-and-reel packaging.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 48
- Lifecycle
- OBSOLETE
- Datasheet
- 74AHC16244DGVRE4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of 74AHC16244DGVRE4?
- 16-bit non-inverting buffer with dual active-low output-enable pins for independent 8-bit bank control
- AHC-family CMOS logic operates from 2 V to 5.5 V with propagation delay under 5 ns at 3.3 V
- 3-state outputs with 8 mA sink current per channel for driving multi-load data buses in backplane designs
What is 74AHC16244DGVRE4 used for?
The 74AHC16244DGVRE4 is used to buffer and drive 16-bit address and data buses in microprocessor-based systems, memory interfaces, and backplane interconnects where high-speed signal integrity and bus isolation are required. Its dual output-enable architecture allows the buffer to be split into two independent 8-bit sections, making it suitable for bidirectional bus expansion and level-translation applications in embedded control systems operating at 3.3 V or 5 V.
What are the specifications of 74AHC16244DGVRE4?
| Pbfree Code | Yes |
| YTEOL | 0 |
| Additional Feature | WITH DUAL OUTPUT ENABLE |
| Control Type | ENABLE LOW |
| Family | AHC/VHC/H/U/V |
| JESD-30 Code | R-PDSO-G48 |
| JESD-609 Code | e4 |
| Logic IC Type | BUS DRIVER |
| Max I(ol) | 0.008A |
| Number of Bits | 4 |
| Number of Functions | 4 |
| Number of Ports | 2 |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP48,.25,16 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Prop. Delay@Nom-Sup | 8.5ns |
| Propagation Delay (tpd) | 13.5ns |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2V |
| Supply Voltage-Nom (Vsup) | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.4mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| HTS Code | 8542.39.00.60 |
Where can I find the 74AHC16244DGVRE4 datasheet?
74AHC16244DGVRE4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for 74AHC16244DGVRE4?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for 74AHC16244DGVRE4 with 2 V to 5.5 V?
74AHC16244DGVRE4 fits industrial, embedded, and repair-oriented electronic assemblies when the design needs 2 V to 5.5 V and 8 mA. It is a practical choice when the BOM also matches the 48-pin SSOP footprint.
How should engineers check package compatibility for 74AHC16244DGVRE4?
Compare the PCB land pattern, height allowance, and assembly process against the 48-pin SSOP style. The 48 pins detail is the first check before approving a replacement.
What matters when sourcing 74AHC16244DGVRE4 as a replacement?
Confirm the same 2 V to 5.5 V, 8 mA, manufacturer traceability, and lifecycle status before substituting it. Buyers should also verify stock for the exact 48-pin SSOP configuration.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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