66AK2G12ABY60 Texas Instruments Integrated Circuit (BGA) In Stock
66AK2G12ABY60 is a dual-core ARM Cortex-A15 and DSP SoC by Texas Instruments for high-performance embedded processing. Key specs: 600MHz clock, 625-ball BGA package, 0.945V core supply. From $45.00, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 625
- Lifecycle
- ACTIVE
- Datasheet
- 66AK2G12ABY60 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $54.7900(MOQ 60)
- Temp Range
- ?°C to 90.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-core ARM Cortex-A15 paired with C66x DSP delivers simultaneous general-purpose and signal-processing workloads
- 625-ball FCBGA package in a 25x25mm footprint with 0.8mm ball pitch for high-density PCB integration
- Supports up to 600MHz operation for real-time communications and compute-intensive applications
- Lead-free, RoHS-compliant construction with 260°C peak reflow temperature compatibility
- Integrated peripherals reduce external component count in industrial and communications platforms
Applications
The 66AK2G12ABY60 is designed for industrial communications, audio processing, and smart grid infrastructure applications requiring both real-time DSP performance and application-layer processing. Its heterogeneous multicore architecture is ideal for software-defined radio, industrial motor control, and professional audio equipment. The device also suits embedded computing platforms in test and measurement, medical instrumentation, and telecommunications base station designs.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| JESD-30 Code | S-PBGA-B625 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA625,25X25,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 0.945V |
| Supply Voltage-Min | 0.855V |
| Supply Voltage-Nom | 0.9V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | SoC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.75 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for 66AK2G12ABY60:
Frequently Asked Questions
What processor cores does the 66AK2G12ABY60 include?
The 66AK2G12ABY60 integrates a dual-core ARM Cortex-A15 application processor alongside a C66x digital signal processor (DSP). This heterogeneous multicore architecture allows the device to simultaneously handle general-purpose OS workloads and real-time signal processing tasks with low latency.
What is the operating frequency of the 66AK2G12ABY60?
The 66AK2G12ABY60 is rated for 600MHz operation (as denoted by the '60' speed suffix). This clock rate enables demanding real-time processing tasks in industrial communications and audio signal processing applications while maintaining power efficiency in embedded system designs.
What package does the 66AK2G12ABY60 use?
The 66AK2G12ABY60 is housed in a 625-ball fine-pitch BGA package (JESD-30 code: S-PBGA-B625) measuring 25x25mm with a 0.8mm ball pitch. This high-density package style supports the large pin count required by the device's rich peripheral set and memory interfaces.
What is the core supply voltage of the 66AK2G12ABY60?
The 66AK2G12ABY60 operates with a maximum core supply voltage of 0.945V. This low-voltage operation reduces overall power consumption and heat dissipation, making the device well-suited for thermally constrained embedded systems and industrial equipment requiring high reliability.
What are typical applications for the 66AK2G12ABY60?
Typical applications include industrial communications gateways, professional audio and video processing equipment, software-defined radio platforms, smart grid edge devices, and medical instrumentation. The device's combination of ARM application cores and DSP acceleration makes it ideal wherever both OS-level software and real-time signal processing coexist.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 60+ | $58.6600 | $3519.60 |
| 120+ | $54.7900 | $6574.80 |
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