48L640T-I/MNY Microchip Integrated Circuit (Small Outline No-lead) In Stock
Microchip 48L640T-I/MNY is a 64Kbit (8K x 8) standard SRAM IC with a 66 MHz maximum clock frequency. Housed in a compact TDFN-8 (Small Outline No-lead) package with 8-bit data width and common I/O interface. Available in stock worldwide with competitive pricing.
- Manufacturer
- Microchip
- Package
- Small Outline No-lead
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- 48L640T-I/MNY Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64Kbit (8K x 8) standard SRAM with 66 MHz maximum clock frequency for fast embedded memory access
- Ultra-compact TDFN-8 (8-pin no-lead) package enables high-density PCB layouts in space-constrained designs
- Common I/O interface with 8-bit data width simplifies integration with 8-bit and 32-bit microcontrollers
Applications
The 48L640T-I/MNY is ideal for embedded systems requiring fast scratch-pad memory, such as IoT edge nodes, wearable devices, and portable medical instruments where board space is critical. Its 66 MHz clock speed and compact TDFN-8 footprint make it well suited for buffering data in industrial sensor modules and communication peripherals paired with low-power microcontrollers.
Specifications
| Manufacturer Package Code | TDFN-8 |
| Date Of Intro | 2019-10-28 |
| YTEOL | 0 |
| Clock Frequency-Max (fCLK) | 66MHz |
| I/O Type | COMMON |
| JESD-30 Code | R-PDSO-N8 |
| JESD-609 Code | e4 |
| Memory Density | 65536bit |
| Memory IC Type | STANDARD SRAM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Words | 8192words |
| Number of Words Code | 8000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 8KX8 |
| Output Characteristics | 3-STATE |
| Output Enable | NO |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOLCC8,.11,20 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Cel) | 260 |
| Standby Current-Max | 0.0002A |
| Standby Voltage-Min | 2.7V |
| Supply Current-Max | 0.005mA |
| Supply Voltage-Max (Vsup) | 3.6V |
| Supply Voltage-Min (Vsup) | 2.7V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | DUAL |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How fast can the 48L640T-I/MNY operate, and what memory density does it provide?
The 48L640T-I/MNY supports a maximum clock frequency of 66 MHz and provides 65536 bits (64Kbit) of standard SRAM organized as 8K x 8-bit words. This combination of speed and density makes it suitable for high-throughput data buffering in embedded microcontroller designs operating at 3.3 V.
For which compact PCB designs is the TDFN-8 package of the 48L640T-I/MNY most advantageous?
The TDFN-8 no-lead package of the 48L640T-I/MNY is especially advantageous for wearable electronics, IoT sensor nodes, and miniaturized industrial modules where PCB area is limited to just a few square millimeters. The 8-pin footprint allows placement close to microcontrollers, reducing trace inductance and supporting 66 MHz operation with minimal signal integrity issues.
When would 48L640T-I/MNY be preferred over larger SRAM options in a microcontroller design?
When a design requires only 64Kbit of scratch-pad or stack memory and board space is limited, the 48L640T-I/MNY offers the best size-to-performance ratio with its 8-pin TDFN footprint and 66 MHz clock capability. It is preferred over larger 128Kbit or 256Kbit SRAMs in cost-sensitive embedded applications where 8K x 8 capacity is sufficient for the firmware data buffer.
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