25CSM04-I/MF Microchip Integrated Circuit (Small Outline No-lead) In Stock
The 25CSM04-I/MF is a 4 Mbit SPI EEPROM from Microchip in an 8-pin WSON (6 × 5 mm) package. It operates at up to 8 MHz SPI clock and provides 1,000,000 write/erase cycles with a minimum 100-year data retention rating. Designed for industrial and consumer embedded systems requiring high-density non-volatile serial memory.
- Manufacturer
- Microchip
- Package
- Small Outline No-lead
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- 25CSM04-I/MF Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $2.0000(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4 Mbit (512 KB) SPI EEPROM with up to 8 MHz clock for fast serial data access
- 1,000,000 write/erase cycle endurance with 100-year minimum data retention for long-life reliability
- Compact WSON-8 package (6 × 5 mm) enabling high-density non-volatile storage in space-constrained PCB designs
Applications
The 25CSM04-I/MF is used in embedded systems for bulk data logging, firmware storage, and configuration parameter retention across industrial controllers, smart meters, and automotive telematics modules. Its 4 Mbit capacity and 8 MHz SPI interface support rapid boot-time data loading and runtime parameter updates in microcontroller-based designs. The WSON-8 footprint and RoHS compliance make it compatible with modern surface-mount assembly processes in consumer and industrial product lines.
Specifications
| Manufacturer Package Code | WSON-8 |
| Factory Lead Time | 17Weeks |
| YTEOL | 19 |
| Clock Frequency-Max (fCLK) | 8MHz |
| Data Retention Time-Min | 100 |
| Endurance | 1000000 Write/Erase Cycles |
| JESD-30 Code | R-PDSO-N8 |
| JESD-609 Code | e3 |
| Memory Density | 4194304bit |
| Memory IC Type | EEPROM |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Words | 524288words |
| Number of Words Code | 512000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 512KX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOLCC8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Parallel/Serial | SERIAL |
| Programming Voltage | 5V |
| Serial Bus Type | SPI |
| Standby Current-Max | 0.000002A |
| Supply Current-Max | 0.003mA |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 2.5V |
| Supply Voltage-Nom (Vsup) | 5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Write Cycle Time-Max (tWC) | 5ms |
| Write Protection | HARDWARE/SOFTWARE |
| Package | Small Outline No-lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
| Country of Origin | Taiwan, Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What SPI clock speed does the 25CSM04-I/MF support, and how does this compare to I2C EEPROM alternatives?
The 25CSM04-I/MF supports a maximum SPI clock frequency of 8 MHz, which is 20 times faster than a standard 400 kHz I2C EEPROM. At 8 MHz, reading the full 512 KB memory content takes approximately 0.5 seconds in sequential mode, making it suitable for firmware image loading at system boot in embedded controllers.
For applications requiring high write frequency, how long can the 25CSM04-I/MF realistically last?
With a rated endurance of 1,000,000 write/erase cycles per page and 100-year minimum data retention, the 25CSM04-I/MF can sustain one write per minute for nearly 2 years before approaching wear limits on frequently written pages. Wear-leveling firmware across the 4 Mbit address space extends operational life significantly for data-logging applications.
How does the WSON-8 package dimension of the 25CSM04-I/MF compare to a standard SOIC-8, and what does this mean for board layout?
The 25CSM04-I/MF WSON-8 package measures 6 × 5 mm with exposed pad construction, compared to a typical SOIC-8 at approximately 4.9 × 3.9 mm body with larger lead pitch. The exposed pad improves thermal dissipation during high-frequency 8 MHz operation, while the no-lead format reduces parasitic inductance on SPI signal pins for cleaner 8 MHz data integrity.
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