24LC1026-I/PAlternatives & Equivalent Parts
About 24LC1026-I/P
24LC1026-I/P is a Integrated Circuit component manufactured by Microchip. It comes in a Dual-In-Line Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | 24LC1026-I/PSource | 24LC1025-I/SM | 24LC128-I/MF | 24LC128-I/P | 24LC128-I/SM | GRM21BR71C475KA73L | T491D476K010AT | 24LC1025-I/P |
|---|---|---|---|---|---|---|---|---|
| Manufacturer | Microchip | Microchip | Microchip | Microchip | Microchip | Murata Electronics | Kemet | Microchip |
| Package Type | Dual-In-Line Packages | Small Outline Packages | Small Outline No-lead | Dual-In-Line Packages | Small Outline Packages | Capacitor Chip Non-polarised | Other | Dual-In-Line Packages |
| Pin Count | 8 | 8 | 8 | 8 | 8 | 2 | 2 | 8 |
| Temperature Range | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C | -55.0°C ~ 125.0°C | — | -40.0°C ~ 85.0°C |
| Price | $3.3700 | $1.6400 | $0.8500 | $0.4250 | $0.3700 | $0.0563 | $0.0800 | $1.6100 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | ACTIVE | ACTIVE | ACTIVE | OBSOLETE | — | ACTIVE |
| Electrical Parameters | ||||||||
| Manufacturer Package Code | PDIP-8 | SOIJ-8 | DFN-S-8 | PDIP-8 | SOIJ-8 | — | — | PDIP-8 |
| Factory Lead Time | 22 Weeks | 21 Weeks | 2 Weeks | 14 Weeks | 13 Weeks | — | — | 15 Weeks |
| YTEOL | 13 | 9 | 8 | 8 | 8 | 0 | — | 9 |
| Clock Frequency-Max (fCLK) | 0.4 MHz | 1 MHz | 0.4 MHz | 0.4 MHz | 0.4 MHz | — | — | 1 MHz |
| Data Retention Time-Min | 200 | 200 | 200 | 200 | 200 | — | — | 200 |
| Endurance | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | — | — | 1000000 Write/Erase Cycles |
| I2C Control Byte | 1010DDMR | 1010MDDR | 1010DDDR | 1010DDDR | 1010DDDR | — | — | 1010MDDR |
| JESD-30 Code | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-N8 | R-PDIP-T8 | R-PDSO-G8 | — | — | R-PDIP-T8 |
| JESD-609 Code | e3 | e3 | e3 | e3 | e3 | e3 | — | e3 |
| Memory Density | 1048576 bit | 1048576 bit | 131072 bit | 131072 bit | 131072 bit | — | — | 1048576 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | — | — | EEPROM |
| Memory Width | 8 | 8 | 8 | 8 | 8 | — | — | 8 |
| Number of Functions | 1 | 1 | 1 | 1 | 1 | — | — | 1 |
| Number of Ports | 1 | 1 | 1 | 1 | 1 | — | — | 1 |
| Number of Words | 131072 words | 131072 words | 16384 words | 16384 words | 16384 words | — | — | 131072 words |
| Number of Words Code | 128000 | 128000 | 16000 | 16000 | 16000 | — | — | 128000 |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | — | — | SYNCHRONOUS |
| Organization | 128KX8 | 128KX8 | 16KX8 | 16KX8 | 16KX8 | — | — | 128KX8 |
| Output Characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | — | — | OPEN-DRAIN |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | — | — | PLASTIC/EPOXY |
| Package Equivalence Code | DIP8,.3 | SOP8,.3 | SOLCC8,.25 | DIP8,.3 | SOP8,.3 | — | — | DIP8,.3 |
| Package Shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR PACKAGE | — | RECTANGULAR |
| Package Style | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | IN-LINE | SMALL OUTLINE | SMT | — | IN-LINE |
| Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | — | — | SERIAL |
| Programming Voltage | 5 V | 5 V | 4.5 V | 4.5 V | 4.5 V | — | — | 5 V |
| Qualification Status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | — | — | Not Qualified |
| Screening Level | TS 16949 | — | AEC-Q100 | AEC-Q100 | AEC-Q100 | — | — | — |
| Serial Bus Type | I2C | I2C | I2C | I2C | I2C | — | — | I2C |
| Standby Current-Max | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | — | — | 0.000005 A |
| Supply Current-Max | 0.005 mA | 0.005 mA | 0.003 mA | 0.003 mA | 0.003 mA | — | — | 0.005 mA |
| Supply Voltage-Max (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | — | — | 5.5 V |
| Supply Voltage-Min (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | — | — | 2.5 V |
| Supply Voltage-Nom (Vsup) | 5 V | 5 V | 4.5 V | 4.5 V | 4.5 V | — | — | 5 V |
| Surface Mount | NO | YES | YES | NO | YES | YES | — | NO |
| Technology | CMOS | CMOS | CMOS | CMOS | CMOS | — | — | CMOS |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | — | — | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) - with Nickel (Ni) barrier | — | Matte Tin (Sn) |
| Terminal Form | THROUGH-HOLE | GULL WING | NO LEAD | THROUGH-HOLE | GULL WING | — | — | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | — | — | 2.54 mm |
| Terminal Position | DUAL | DUAL | DUAL | DUAL | DUAL | — | — | DUAL |
| Write Cycle Time-Max (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | — | — | 5 ms |
| Write Protection | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE | — | — | HARDWARE |
| Pbfree Code | — | Yes | Yes | Yes | Yes | Yes | — | Yes |
| Peak Reflow Temperature (Cel) | — | 260 | 260 | — | 260 | — | — | — |
| Time@Peak Reflow Temperature-Max (s) | — | 40 | 40 | — | 40 | — | — | — |
| Reach Compliance Code | — | — | — | — | — | Compliant | — | — |
| Capacitance | — | — | — | — | — | 4.7 µF | — | — |
| Capacitor Type | — | — | — | — | — | CERAMIC CAPACITOR | — | — |
| Dielectric Material | — | — | — | — | — | CERAMIC | — | — |
| Height | — | — | — | — | — | 1.25 mm | — | — |
| Mounting Feature | — | — | — | — | — | SURFACE MOUNT | — | — |
| Multilayer | — | — | — | — | — | Yes | — | — |
| Negative Tolerance | — | — | — | — | — | 10% | — | — |
| Packing Method | — | — | — | — | — | 180mm Reel W8P4 | — | — |
| Positive Tolerance | — | — | — | — | — | 10% | — | — |
| Rated (DC) Voltage (URdc) | — | — | — | — | — | 16 V | — | — |
| Size Code | — | — | — | — | — | 2012M/0805 | — | — |
| Temperature Characteristics Code | — | — | — | — | — | X7R | — | — |
| Temperature Coefficient | — | — | — | — | — | 15% ppm/°C | — | — |
| Terminal Shape | — | — | — | — | — | WRAPAROUND | — | — |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Get one quote covering all 7 alternatives for 24LC1026-I/P — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for 24LC1026-I/P is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating 24LC1026-I/P replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to 24LC1026-I/P?
Known equivalents for 24LC1026-I/P include 24LC1025-I/SM, 24LC128-I/MF, 24LC128-I/P. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of 24LC1026-I/P?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify 24LC1026-I/P alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.