2227MC-08-03-18-F1Alternatives & Equivalent Parts
About 2227MC-08-03-18-F1
2227MC-08-03-18-F1 is a Undefined or Miscellaneous component manufactured by MULTICOMP. It comes in a Dual-In-Line Sockets package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | 2227MC-08-03-18-F1Source | TPD2S300YFFR | LM833N |
|---|---|---|---|
| Manufacturer | MULTICOMP | Texas Instruments | Texas Instruments |
| Package Type | Dual-In-Line Sockets | BGA | Dual-In-Line Packages |
| Pin Count | 8 | 9 | 8 |
| Temperature Range | -25.0°C ~ 105.0°C | -40.0°C ~ 85.0°C | -40.0°C ~ 85.0°C |
| Price | $0.2530 | $0.1250 | $0.5000 |
| Stock | In Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE | OBSOLETE |
| Electrical Parameters | |||
| YTEOL | 7.3 | 15 | 0 |
| Additional Feature | STANDARD: UL 94V-0 | — | — |
| Body Breadth | 0.4 inch | — | — |
| Body Depth | 0.165 inch | — | — |
| Body Length | 0.4 inch | — | — |
| Contact Configuration | RECTANGLE | — | — |
| Contact Style | RND PIN-SKT | — | — |
| Current Rating | 3 A | — | — |
| Device Socket Type | IC SOCKET | — | — |
| Device Type Used On | DIP8 | — | — |
| Dielectric Withstanding Voltage | 1000VAC V | — | — |
| Housing Material | POLYBUTYLENE TEREPHTHALATE | — | — |
| Insulation Resistance | 1000000000 Ω | — | — |
| Mating Contact Pitch | 0.1 inch | — | — |
| Mounting Style | STRAIGHT | — | — |
| Number of Contacts | 8 | — | — |
| PCB Contact Pattern | RECTANGULAR | — | — |
| PCB Contact Row Spacing | 0.30000000000000004 mm | — | — |
| Terminal Pitch | 2.54 mm | 0.4 mm | 2.54 mm |
| Termination Type | SOLDER | — | — |
| Pbfree Code | — | Yes | No |
| Adjustable Threshold | — | NO | — |
| Analog IC - Other Type | — | USB PD CONTROLLER | — |
| JESD-30 Code | — | S-XBGA-B9 | R-PDIP-T8 |
| JESD-609 Code | — | e1 | e0 |
| Number of Channels | — | 2 | — |
| Number of Functions | — | 1 | 2 |
| Package Body Material | — | UNSPECIFIED | PLASTIC/EPOXY |
| Package Equivalence Code | — | BGA9,3X3,16 | DIP8,.3 |
| Package Shape | — | SQUARE | RECTANGULAR |
| Package Style | — | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | IN-LINE |
| Peak Reflow Temperature (Cel) | — | 260 | — |
| Supply Voltage-Max (Vsup) | — | 4.5 V | — |
| Supply Voltage-Min (Vsup) | — | 2.7 V | — |
| Supply Voltage-Nom (Vsup) | — | 3.3 V | 15 V |
| Surface Mount | — | YES | NO |
| Terminal Finish | — | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD |
| Terminal Form | — | BALL | THROUGH-HOLE |
| Terminal Position | — | BOTTOM | DUAL |
| Threshold Voltage-Nom | — | +2.3V | — |
| Time@Peak Reflow Temperature-Max (s) | — | 30 | — |
| Amplifier Type | — | — | OPERATIONAL AMPLIFIER |
| Architecture | — | — | VOLTAGE-FEEDBACK |
| Bias Current-Max (IIB) @25C | — | — | 1 µA |
| Common-mode Reject Ratio-Min | — | — | 80 dB |
| Common-mode Reject Ratio-Nom | — | — | 100 dB |
| Frequency Compensation | — | — | YES |
| Input Offset Voltage-Max | — | — | 5000 µV |
| Low-Bias | — | — | NO |
| Low-Offset | — | — | NO |
| Micropower | — | — | NO |
| Neg Supply Voltage-Nom (Vsup) | — | — | -15 V |
| Power | — | — | NO |
| Programmable Power | — | — | NO |
| Slew Rate-Min | — | — | 4 V/us |
| Slew Rate-Nom | — | — | 7 V/us |
| Supply Current-Max | — | — | 8 mA |
| Supply Voltage Limit-Max | — | — | 36 V |
| Technology | — | — | BIPOLAR |
| Temperature Grade | — | — | INDUSTRIAL |
| Unity Gain BW-Nom | — | — | 9000 |
| Voltage Gain-Min | — | — | 31622.7 |
| Wideband | — | — | NO |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Need pricing on these alternatives?
Get one quote covering all 2 alternatives for 2227MC-08-03-18-F1 — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for 2227MC-08-03-18-F1 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating 2227MC-08-03-18-F1 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to 2227MC-08-03-18-F1?
Known equivalents for 2227MC-08-03-18-F1 include TPD2S300YFFR, LM833N. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of 2227MC-08-03-18-F1?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify 2227MC-08-03-18-F1 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.