Zener Diode

Zener Diode components are essential building blocks in modern electronic systems. FindMyChip sources Zener Diode ICs from authorized China distributors with competitive pricing and reliable stock.

922 components

How to Choose Zener Diode Components

  • 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
  • 2Check package footprint and thermal characteristics against your PCB layout constraints.
  • 3Confirm lifecycle status and long-term availability for production designs.

Popular Applications

Consumer Electronics

Smartphones, tablets, and smart home devices

Industrial Systems

Factory automation, control systems, and monitoring

Automotive

In-vehicle electronics and advanced driver assistance

Telecommunications

Base stations, routers, and network equipment

All Zener Diode Components

Showing 601–650 of 922

1SMB5943BT3GON Semiconductor

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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MMSZ5231BT1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

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1SMB5914BT3GON Semiconductor

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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1.5KE27CALITTELFUSE

LITTELFUSE 1.5KE27CA is a Zener Diode for rectification, protection, clamping, and switching circuits. It provides 2 pins in a Diodes, Axial Diameter Horizontal Mounting, with Pb-free sourcing details. From quote-based pricing, request stock for worldwide shipping.

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BZV55-C12,115Nexperia

Nexperia BZV55-C12,115 is a Zener Diode for rectification, protection, clamping, and switching circuits. It provides 2 pins in a 2-pin package, with manufacturer documented sourcing details. From quote-based pricing, request stock for worldwide shipping.

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BZV55-B5V6,115Nexperia

Nexperia BZV55-B5V6,115 is a Zener Diode for rectification, protection, clamping, and switching circuits. It provides 2 pins in a 2-pin package, with manufacturer documented sourcing details. From quote-based pricing, request stock for worldwide shipping.

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1N4740AMULTICOMP

Use the download button to access the 1N4740A schematic symbol, PCB footprint, and 3D model.

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MMSZ3V3T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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BZX84C3V3LT1GON Semiconductor

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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BZX79-C3V3,113Nexperia

3.3V Zener diode,BZX79C3V3 500mW NXP BZX79-C3V3,113 Zener Diode, 3.3V 5% 0.5 W Through Hole 2-Pin DO-35

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DDZ9678-7Diodes Inc.

Use the download button to access the DDZ9678-7 schematic symbol, PCB footprint, and 3D model.

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KDZTR30BROHM Semiconductor

Use the download button to access the KDZTR30B schematic symbol, PCB footprint, and 3D model.

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MMSZ4678T1GON Semiconductor

SOD-123, 2 PIN

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MMSZ4680T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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BZT52C8V2-7-FDiodes Inc.

Use the download button to access the BZT52C8V2-7-F schematic symbol, PCB footprint, and 3D model.

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MMSZ5230B-7-FDiodes Inc.

Use the download button to access the MMSZ5230B-7-F schematic symbol, PCB footprint, and 3D model.

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MMSZ5231B-7-FDiodes Inc.

Use the download button to access the MMSZ5231B-7-F schematic symbol, PCB footprint, and 3D model.

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BZT52C12-7-FDiodes Inc.

Use the download button to access the BZT52C12-7-F schematic symbol, PCB footprint, and 3D model.

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MMSZ4V3T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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MMSZ10T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SZMMSZ5253BT1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

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BZT585B5V1TQ-7Diodes Inc.

• ±2.0% Tolerance on Breakdown Voltage • Small, Low Profile Surface Mount Package • Flat Lead Package Design for Low Profile and High Power Dissipation • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • The BZT585B2V4TQ - BZT585B43TQ is suitable for automotive applications requiring specific change control and is AEC-Q101 qualified, is PPAP capable, and is manufactured in IATF16949:2016 certified facilities.

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UDZSTE-1716BROHM Semiconductor

UDZSTE-1716B is a ROHM Semiconductor Zener Diode for rectification, voltage clamping, reverse-polarity protection, and power conversion. It combines -55°C to 150°C with SC-76 with 2 pins. FindMyChip supports technical sourcing, stock checks, and worldwide shipping for this part.

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MMSZ16T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SMBJ36A-13-FDiodes Inc.

SMB, 2 PIN

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1N750Microsemi Corporation

HERMETIC SEALED, GLASS PACKAGE-2

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AZ23C3V3-7-FDiodes Inc.

Use the download button to access the AZ23C3V3-7-F schematic symbol, PCB footprint, and 3D model.

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TDZ6V8JNexperia

Nexperia TDZ6V8J is a single silicon Zener diode with a 6.8 V nominal Zener voltage in a SOD-323F flat-lead surface mount package. It features a maximum dynamic impedance of 15 Ω and knee impedance of 80 Ω for stable voltage clamping in compact PCB designs. Available from stock worldwide with competitive pricing and rapid shipping.

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MMSZ4679T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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MMSZ5256BT1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA

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BZT52C47Taiwan Semiconductor

Zener Diodes 47 Volt 410mW 5%

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BZT52C5V1T-7Diodes Inc.

Use the download button to access the BZT52C5V1T-7 schematic symbol, PCB footprint, and 3D model.

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JANTX1N4099UR-1Microsemi Corporation

DO-213AA, 2 PIN

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1N5353BRLGON Semiconductor

POLARITY: Cathode indicated by color band. When operated in zener mode, cathode will be positive with respect to anode.; Maximum Limits Guaranteed on Seven Electrical Parameters; CASE: Void-free, transfer-molded, thermo-setting plastic; MOUNTING POSITION: Any; Up to 180 Watt Surge Rating @ 8.3 ms; FINISH: All external surfaces are corrosion resistant and leads are readily solderable; WEIGHT: 0.7 gram (approx); Pb-Free Packages are Available

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MM3Z56VBON Semiconductor

SOD-323FL, SC-90, 2 PIN

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1SMA5918BT3GON Semiconductor

Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con

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BZV55-C3V3,115Nexperia

SOD-80C, 2 PIN

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BZT52C3V3T-7Diodes Inc.

Use the download button to access the BZT52C3V3T-7 schematic symbol, PCB footprint, and 3D model.

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1N751AMULTICOMP

GLASS PACAKGE-2

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MMSZ4703T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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SZMMSZ4703T1GON Semiconductor

500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 1.8 V to 43 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLARITY: Cathode indicated by polarit

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MMBZ5246BLT1GON Semiconductor

225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING:

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MM5Z16VT1GON Semiconductor

Standard Zener Breakdown Voltage Range: 2.4V to 75V; Steady State Power Rating of 500mW; Small Body Outline Dimensions: 0.047in x 0.032in (1.20mm x 0.80mm); Low Body Height: 0.028in (0.7mm); ESD Rating of Class 3 (>16kV) Human Body Model; Epoxy Meets UL94, VO; Cathode Indicated by Polarity Band; Lead Finish: 100% Matte Sn (Tin); Qualified Maximum Reflow Temperature: 260C; Device Meets MSL 1 Requirements; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other

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1SMB5918BT3GON Semiconductor

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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1SMB5947BT3GON Semiconductor

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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1SMB5930BT3GON Semiconductor

Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi

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BZT52C5V6LP-7Diodes Inc.

Use the download button to access the BZT52C5V6LP-7 schematic symbol, PCB footprint, and 3D model.

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BZT52C16T-7Diodes Inc.

Use the download button to access the BZT52C16T-7 schematic symbol, PCB footprint, and 3D model.

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BZX84C4V7LT1GON Semiconductor

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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SZBZX84C4V7LT1GON Semiconductor

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

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