Undefined or Miscellaneous

Undefined or Miscellaneous components are essential building blocks in modern electronic systems. FindMyChip sources Undefined or Miscellaneous ICs from authorized China distributors with competitive pricing and reliable stock.

1,005 components

How to Choose Undefined or Miscellaneous Components

  • 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
  • 2Check package footprint and thermal characteristics against your PCB layout constraints.
  • 3Confirm lifecycle status and long-term availability for production designs.

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All Undefined or Miscellaneous Components

Showing 251300 of 1,005

74AHC1G125W5-7Diodes Inc.

DiodesZetex 74AHC1G125W5-7, Buffer, Bus driver 3-State, Non-Inverting, 2 → 5.5 V, 5-Pin SOT-25

74AHC1G08W5-7Diodes Inc.

74AHC1G08W5-7 is a Diodes Inc. Diode for rectification and reverse-polarity protection. Key specs include 5 pins, -40°C to 125°C, and 74A. Request quote pricing, in-stock sourcing, and worldwide shipping for production builds.

74AHC1G08SE-7Diodes Inc.

ROHS COMPLIANT, SOT-353, 5 PIN

74AHC1G02SE-7Diodes Inc.

74AHC1G02SE-7 is a Diodes Inc. Diode for rectification and reverse-polarity protection. Key specs include 5 pins, -40°C to 125°C, and 74A. Request quote pricing, in-stock sourcing, and worldwide shipping for production builds.

2DB1694-7Diodes Inc.

Use the download button to access the 2DB1694-7 schematic symbol, PCB footprint, and 3D model.

NC7WZ07FHXON Semiconductor

Over-Voltage Tolerant Inputs Facilitate 5V to 3V Translation ; Ultra-Small MicroPak™ Packages; Proprietay Noise/EMI Reduction Circuitry ; Ultra-High Speed: tPZL 2.3ns (Typical) ; Power Down High Iimpedance Inputs/Outputs ; High IOL Output Drive: +24mA at 3V VCC ; Broad VCC Operating Range: 1.65V to 5.5V

NC7WZ02K8XON Semiconductor

Power down high impedance inputs/output; Space saving US8 surface mount package; High Output Drive: ±24 mA at 3V VCC; Overvoltage tolerant inputs facilitate 5V to 3V translation; Broad VCC Operating Range: 1.65V to 5.5V; MicroPak™ Pb-Free leadless package; Ultra High Speed: tPD 2.4 ns typ into 50 pF at 5V VCC; Matches the performance of LCX when operated at 3.3V VCC; Patented noise/EMI reduction circuitry implemented

NC7SZ126M5ON Semiconductor

Fairchild Semiconductor NC7SZ126M5, Buffer 3-State, Non-Inverting, 1.65 → 5.5 V, 5-Pin SOT-23

NC7SZ08P5XXON Semiconductor

NC7SZ08P5XX is a ON Semiconductor undefined or miscellaneous for industrial electronics, embedded systems, maintenance builds, and production sourcing programs. It combines 5-pin configuration, SOT23 (5-Pin) assembly style, and datasheet-backed identification. From RFQ-based sourcing, in-stock options can support worldwide shipping.

NC7SZ04M5ON Semiconductor

NC7SZ04M5 is a ON Semiconductor undefined or miscellaneous for industrial electronics, embedded systems, maintenance builds, and production sourcing programs. It combines 5-pin configuration, LSSOP assembly style, and datasheet-backed identification. From RFQ-based sourcing, in-stock options can support worldwide shipping.

NC7SV17P5XON Semiconductor

±24mA at 3.00V VCC ; ±6mA at 1.65V VCC ; Power-Off High-Impedance Inputs and Outputs ; ±0.1mA at 0.9V VCC ; Extremely High Speed tPD ; 2.0ns: Typical for 1.65V to 1.95V VCC ; 3.6V Over-Voltage Tolerant I/Os at VCC from 0.9V to 3.6V ; 1.8ns: Typical for 2.3V to 2.7V VCC ; ±4mA at 1.4V VCC ; ±2mA at 1.1V VCC ; High Static Drive (IOH/IOL) ; ±18mA at 2.30V VCC ; Ultra-Low Dynamic Power; 5.9ns: Typical for 1.1V to 1.3V VCC ; Ultra-Small MicroPak™ Packages ; 1.5ns: Typical for 2.7V to 3.6V VCC ; 12.0ns: Typical f

NC7SV157P6XON Semiconductor

Extremely High Speed tPD1.5 ns typ for 2.7V to 3.6V VCC2.0 ns typ for 2.3V to 2.7V VCC3.0 ns typ for 1.65V to 1.95V VCC4.0 ns typ for 1.4V to 1.6V VCC8.0 ns typ for 1.1V to 1.3V VCC16.0 ns typ for 0.9V VCC; Ultra low dynamic power; 0.9V to 3.6V VCC supply operation; Ultra small MicroPak™ leadfree package; 3.6V overvoltage tolerant I/O's at VCC from 0.9V to 3.6V; Uses patented Quiet Series™ noise/EMI reduction circuitry; Power-Off high impedance inputs and outputs; High Static Drive (IOH/IOL)±24 mA @ 3.00V V

NC7SP125P5XON Semiconductor

Ultra small MicroPak™ leadfree packages; Power-Off high impedance inputs and outputs; 0.9V to 3.6V VCC supply operation; Uses patented Quiet Series™ noise/EMI reduction circuitry; 3.6V overvoltage tolerant I/O's at VCC from 0.9V to 3.6V; tPD3 ns typ for 3.0V to 3.6V VCC4 ns typ for 2.3V to 2.7V VCC5 ns typ for 1.65V to 1.95V VCC6 ns typ for 1.40V to 1.60V VCC10 ns typ for 1.10V to 1.30V VCC26 ns typ for 0.90V VCC; Static Drive (IOH/IOL)±2.6 mA @ 3.00V VCC±2.1 mA @ 2.30V VCC±1.5 mA @ 1.65V VCC±1.0 mA @ 1.40V

NC7SBU3157P6XON Semiconductor

SC-70, 6 PIN

NC7S14P5XON Semiconductor

Schmitt input hysteresis: > 1V typ; High speed: tPD 4.5 ns typ; Specified for 3V operation; Balanced output drive: 2 mA IOL, -2 mA IOH; Broad VCC operating range: 2V - 6V; Balanced propagation delays; Low quiescent power: ICC < 1 µA; Space saving SOT23 or SC70 5-lead package; Ultra small MicroPak™ leadless package

NC7S02M5ON Semiconductor

Fairchild Semiconductor NC7S02M5, NOR 2 Input NOR, 2 → 6 V, 5-Pin SOT-23

MM74HCT573WMON Semiconductor

SOIC-20

MM74HCT374WMON Semiconductor

Low quiescent current: 80 µA maximum; Output drive capability: 15 LS-TTL loads; Typical propagation delay: 20 ns; Compatible with bus-oriented systems; Low input current: 1 µA maximum; TTL input characteristic compatible

MM74HCT164MON Semiconductor

MM74HCT164M is a ON Semiconductor undefined or miscellaneous for industrial electronics, embedded systems, maintenance builds, and production sourcing programs. It combines 14-pin configuration, SOIC-14 assembly style, and datasheet-backed identification. From RFQ-based sourcing, in-stock options can support worldwide shipping.

MM74HC540WMON Semiconductor

MM74HC540WM is a ON Semiconductor undefined or miscellaneous for industrial electronics, embedded systems, maintenance builds, and production sourcing programs. It combines 20-pin configuration, SOIC-20W assembly style, and datasheet-backed identification. From RFQ-based sourcing, in-stock options can support worldwide shipping.

MM74HC240WMON Semiconductor

MM74HC240WM is a ON Semiconductor undefined or miscellaneous for industrial electronics, embedded systems, maintenance builds, and production sourcing programs. It combines 20-pin configuration, SOIC-20W assembly style, and datasheet-backed identification. From RFQ-based sourcing, in-stock options can support worldwide shipping.

FSA266K8XON Semiconductor

FSA266K8X is a ON Semiconductor Connector for board-to-board interconnects and module stacking. Key specs include 8 pins, -40°C to 85°C, and 3.10 MM. Request quote pricing, in-stock sourcing, and worldwide shipping for production builds.

74ACT541SCON Semiconductor

Inputs and outputs opposite side of package, allowing easier interface to microprocessors; 74AC541 is a non-inverting option of the 74AC540; ICC and IOZ reduced by 50%; 74ACT541 has TTL-compatible inputs; Output source/sink 24 mA; 3-STATE outputs

BCP52ON Semiconductor

Obsolete - PNP 80 V Bipolar Transistor

74VHC86MON Semiconductor

SOIC-14

74VHC541MON Semiconductor

SOIC-20

74VHC32MON Semiconductor

SOIC-14

74VHC08MON Semiconductor

Pin and function compatible with 74HC08; Low power dissipation: ICC = 2 µA (Max) @ TA = 25°C; Power down protection is provided on all inputs; Low noise: VOLP = 0.8V (max); High noise immunity: VNIH = VNIL = 28% VCC (min); High Speed: tPD = 4.3 ns (typ) at TA = 25°C

74LVX04MON Semiconductor

0.150 INCH, MS-012, SOIC-14

74LVT244WMON Semiconductor

SOIC-20

74LCX574WMON Semiconductor

Fairchild Semiconductor 74LCX574WM, Octal, D Type Flip Flop, 3-State, 2 → 3.6 V, 20-Pin SOIC

74LCX32MON Semiconductor

Use the download button to access the 74LCX32M schematic symbol, PCB footprint, and 3D model.

74LCX126MTCON Semiconductor

TSSOP-14

74LCX06MON Semiconductor

SOIC-14

74ACT541MTCON Semiconductor

TSSOP-20

74AC541MTCON Semiconductor

74ACT541 has TTL-compatible inputs; 74AC541 is a non-inverting option of the 74AC540; Inputs and outputs opposite side of package, allowing easier interface to microprocessors; Output source/sink 24 mA; 3-STATE outputs; ICC and IOZ reduced by 50%

MS580305BA01-00TE Connectivity

Dimensions: Dimensions 6.2 x 6.4 MM | Dimensions .24 x .25 INCH | Electrical Characteristics: Board Level Pressure Sensor Supply Voltage 1.8 – 3.6 V | Operation/Application: Pressure 5000 MBAR | Resolution .036 | Board Level Pressure Sensor Accuracy ±120mbar | Output/Span 24 bit ADC | Other: Sensor Options No Option | Packaging Features: Board Level Pressure Sensor Package Surface Mountable | Product Type Features: Board Level Pressure Sensor Style Absolute | Board Level Pressure Sensor Type Digital Pres

DPL12SV2424A25K2TE Connectivity

Body Features: Shaft Style Knurled | Shaft Style Flatted | Product Orientation Vertical | Configuration Features: Adjustment Location Top | Adjustment Method Spindle | Number of Pulses 24 | Number of Detents 24 | Dimensions: Passive Component Dimensions 14.5 x 12.4 x 7 MM | Electrical Characteristics: Passive Component Switch Current Rating .01 AMP | Operation/Application: Operating Speed (Max) 60 RPM | Product Type Features: Passive Component Option Includes Switch | Rotary Encoder Switch Type Push Push SP

5499923-6TE Connectivity

5499923-6 is a TE Connectivity connector for PCB interconnect and production BOM sourcing. Key specs include 26 pins, dual-row layout, 0.336 inch pitch. From inquiry pricing, in stock sourcing, and worldwide shipping support.

5499913-8TE Connectivity

ROHS COMPLIANT

5499374-6TE Connectivity

TE Connectivity AMP LATCH Series, Series Number 5499374, 2.54mm Pitch 26 Way 2 Row Vertical Header, Solder Termination

5499206-5TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Mating Square Post Dimension .025 INCH | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1 AMP | Contact Shape & Form Square |

5102160-6TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 26 | Contact Features: Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Shape & Form Squ

5102160-9TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 40 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Mating Square Post Dimension .64 MM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating M

5102159-6TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 26 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1 AMP | Contact Type Pin | Contact Underplating Material Nickel | Mating Square Post Dimension .64 MM | Mating Square

5102159-4TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Gold | Contact Shape & Form Square |

5102159-3TE Connectivity

Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 16 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | Contact Base Material Phosphor Bronze | Contact Mati

5102159-1TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 10 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1 AMP | Contact Shape & Form Square | Contact Mating Area Plating Material Gold | Mating Square Post Dimension .64 MM | Contac

1761608-9TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Low | Daisy Chain With | Configuration Features: Number of Positions 26 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter .025 INCH | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Shape & Form Square | Contact Current Rating (Max) 1 AMP | Contact M

1761608-6TE Connectivity

Body Features: Primary Product Color Black | Connector Profile Low | Daisy Chain With | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Mating Pin Diameter .64 MM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Current Rating (Max) 1 AMP | Mating Pin D

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