Integrated Circuit
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- 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
- 2Check package footprint and thermal characteristics against your PCB layout constraints.
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Integrated Circuit Guides & Articles
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
All Integrated Circuit Components
Showing 2,101–2,150 of 77,666
The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat
The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat
The R8C/2A Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 20-pin molded-plastic LSSOP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/29 Group has on-chip dat
The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data
The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data
The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data
The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
The R8C/24 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1Mb of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and s
RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com
RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com
RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com
RL78/L1C microcontrollers have a built-in segment LCD driver and USB 2.0 function. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.76 μANote 2, internal voltage boost: 1.23 μA, and capacitive split: 0.74 µA. They support USB high-speed battery charging (Battery Charging Specification 1.2) and com
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/G10 microcontrollers realize the industry's lowest level of consumption current (CPU: 46 μA/MHz, standby (STOP): 560 nA). With an on-chip oscillator, A/D converter, comparator, and more, and a 10/16-pin package lineup, they support more compact system size. These low pin count microcontrollers are perfect for small consumer electronics.
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L13 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.61 μANote 2, and internal voltage boost: 1.42 μA, and capacitive split: 0.77 µA. With a lineup of 64/80-pin products supporting up to 376 segments, these microcontrollers are perfect for
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/L12 microcontrollers have a built-in segment LCD driver. Three LCD driving voltage generation methods (external resistance division, capacitive split, and internal voltage boost) are supported, corresponding to a variety of segment LCD panels. They realize low current consumptionNote 1: external resistance division: 1.60 μANote 2, internal voltage boost: 1.19 μA, and capacitive split: 0.68 µA. With a lineup of 32 to 64-pin products supporting up to 280 segments, these microcontrollers are perfect for s
RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I
RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I
RL78/I1B microcontrollers adapt various electricity meter metrologies for different regulations by country and realize the efficient power measurement by the combination of low active current 96uA/MHz, standby current 0.66uA (Halt mode with 32kHz oscillator and RTC backup on), 24-bit ΔΣA/D converter, phase adjustment circuits and high pass filter. CPU clock frequency can be minimized taking advantage of the efficient power measurement features, which includes the low power ΔΣ A/D converter 0.53mA/ch. RL78/I
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