Integrated Circuit

Use the download button to access the IR2132SPBF schematic symbol, PCB footprint, and 3D model.

DIP-8

INFINEON - IR21271SPBF - MOSFET Driver Single, High Side, 10V-20V supply, 500mA peak out, 125 Ohm output, SOIC-8

PLASTIC, DIP-8

Use the download button to access the IR2118PBF schematic symbol, PCB footprint, and 3D model.

SOIC-16

Use the download button to access the IR2112SPBF schematic symbol, PCB footprint, and 3D model.

Use the download button to access the IR2111SPBF schematic symbol, PCB footprint, and 3D model.

Use the download button to access the IR2108SPBF schematic symbol, PCB footprint, and 3D model.

Use the download button to access the IR2108PBF schematic symbol, PCB footprint, and 3D model.

International Rectifier IR21084SPBF, Dual MOSFET Power Driver 350mA Half Bridge, 10 → 20 V, 14-Pin SOIC

International Rectifier IR2103SPBF, Dual MOSFET Power Driver, 360mA Half Bridge, 10 → 20 V, Non-Inverting, 8-Pin

Use the download button to access the IR2102SPBF schematic symbol, PCB footprint, and 3D model.

International Rectifier AUIRS2184S, Dual MOSFET Power Driver, 2.3A Half Bridge, 10 → 20 V, 8-Pin SOIC

MPL3115A2, Absolute Pressure Sensor, 110kPa 0.9 → 1 V Output, 8-Pin LGA

3 X 3 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, PLASTIC, QFN-16

Freescale MMA3201KEG 2-Axis Accelerometer IC, 360 → 440 Hz 5V 20-Pin SOIC

Latching PWM for Cycle-By-Cycle Current Limiting; Oscillator Frequency Guaranteed at 250 kHz; Low Startup and Operating Current; Trimmed Oscillator for Precise Frequency Control; Internally Trimmed Reference with Undervoltage Lockout; Undervoltage Lockout with Hysteresis; Automatic Feed Forward Compensation; High Current Totem Pole Output; Current Mode Operation to 500 kHz; Pb-Free Packages are Available

Low Output Noise Voltage; Programmable Output Voltage to 36 V; Voltage Reference Tolerance: +/- 0.4%, Typ @ 25°C (TL431B); Equivalent Full-Range Temperature Coefficient of 50 ppm/ °C Typical; Low Dynamic Output Impedance, 0.22 W Typical; Temperature Compensated for Operation over Full Rated Operating Temperature Range; Sink Current Capability of 1.0 mA to 100 mA; Pb-Free Packages are Available

Integrated Power Device • Power Device Thermally Protected • No External Current Shunt Required • 9 V to 18 V Input Range • 44 m Typical • Internal Charge Pump • Internal Undervoltage Lockout Circuit • Internal Overvoltage Clamp (MN1 and MN2 versions) • ESD Ratings: Human Body Model (HBM); 2000 V Machine Model (MM); 200 V • These Devices are Pb−Free and are RoHS Compliant

Use the download button to access the TL431BVDG schematic symbol, PCB footprint, and 3D model.

250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB

Pb-Free Packages are Available; SC-74 Package Allows Four Separate Unidirectional Configurations; Peak Power – 350 Watts, 8 x 20 µS; ESD Rating of Class N (Exceeding 25 kV) per the Human Body Model; ESD Rating: IEC 61000–4–2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000–4–4 (EFT) 40 Amps (5/50 ns) IEC 61000–4–5 (lighting) 23 Amps (8/20 µ s); UL Flammability Rating of 94V–0

Use the download button to access the SMA3107-TL-E schematic symbol, PCB footprint, and 3D model.

TVS Diode in Series with a Compensating Diode Offers < 5 pF Capacitance; ESD Protection Meeting IEC 61000–4–2, 4–4, 4–5; Peak Power Rating of 300 Watts, 8 x 20 µ s; Bi–Direction Protection Can Be Achieved By Using Two Devices; Flammability Rating UL 94V–0; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; Package designed for optimal automated

SE5532AD8G is a ON Semiconductor integrated circuit for PCB-level interconnects, replacement sourcing, or production BOMs. Key specs include 8 pins, -55°C to 125°C operating range, Small Outline Packages. From inquiry pricing, in stock sourcing, and.

Low forward voltage (VF max=0.55V); Short Reverse Recovery Time (trr max=10ns); Low Switching Noise; Low Leakage Current and High Reliability Due to Reliable Planar Structure; Pb-Free and RoHS Compliance

Operating Voltage Range from 3.0 V to 7.0 V; Reference Voltage of 100 mVRMS = 0 dB; One Dedicated Summing Op Amp Per Channel and Two Extra Uncommitted Op Amps; 600 Ω Drive Capability; Single or Split Supply Operation; Wide Input/Output Swing Capability; 3000 V ESD Protection

SOP-8

ON Semiconductor NLU2G17CMX1TCG, Dual, Schmitt Trigger Buffer, CMOS, Non-Inverting, 1.65 → 5.5 V, 6-Pin ULLGA

QFN-12

US-8

Designed for 1.65 V to 5.5 V Vcc Operation; High Speed: tPD = 3.2 ns (Typ) @ VCC = 5.0 V; Low Power Dissipation: ICC = 1 A (Maximum) at TA = 25C; Power Down Protection Provided on inputs; Balanced Propagation Delays; Overvoltage Tolerant (OVT) Input and Output Pins; Ultra-Small Package; This is a Pb-Free Device

Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs, Outputs; LVTTL Compatible – Interface Capability with 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Output Sink Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Chip Complexity: FET = 72; Pb-Free Package is Available

Designed for 1.65 V to 5.5 V VCC Operation; Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5 V; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Chip Complexity: FETs = 72

ON Semiconductor NL27WZ16DTT1G, Dual, Buffer, CMOS, Single Ended, 1.65 → 5.5 V, 6-Pin TSOP

Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible - Interface Capability with 5 V TTL Logic with VCC=3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current (10 ?A) Substantially Reduces System Power Requirements; Current Drive Capability is 24 mA at the Outputs; Chip Complexity: FET = 72; Pb-Free Packages are Available

Tiny SOT-353 and SOT-553 Packages; 2.4 ns TPD at 5 Volts (typ); Source/Sink 24 mA at 3.0 Volts; Over-Voltage Tolerant Inputs and Outputs; Pin For Pin with NC7SZ32P5X, TC7SZ32FU, and TC7SZ32AFE; Chip Complexity: FETs = <100; Designed for 1.65 V to 5.5 V VCC; Pb-Free Packages are Available; Designed for 1.65 V to 5.5 V Vcc Operation

Wide Operating Vcc Range; Tiny SC70-5/SC-88A Package; Source/Sink 24 mA at 3.0 Volts; Over-Voltage Tolerant Inputs and Outputs; Chip Complexity: FETs = 20; Designed for 1.65 V to 5.5 V VCC; Pb-Free Packages are Available

Tiny SOT-353 and SOT-553 Packages; 2.7 ns TPD at 5 Volts (typ); Source/Sink 24 mA at 3.0 Volts; Over-voltage tolerant Inputs; Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE; Chip Complexity: FETs = 20; Designed for 1.65 V to 5.5 V VCC operation; Pb-Free Packages are Available; Wide Operating Vcc Range

120 MHz Unity Gain Bandwidth; Adjustable Gains from 0 to 400; Adjustable Pass Band; No Frequency Compensation Required; Wave Shaping with Minimal External Components; MIL-STD Processing Available

120 MHz Unity Gain Bandwidth; Adjustable Gains from 0 to 400; Adjustable Pass Band; No Frequency Compensation Required; Wave Shaping with Minimal External Components; MIL-STD Processing Available

Last Shipments - LDO Regulator, 500 mA, Low Dropout

Operating Input Voltage Range: 2.5V to 5.5V; High Ripple Rejection Ratio: Typ. 82dB @ 1kHz; Ultra-Low Output Noise: Typ. 10µVrms from 10Hz to 100kHz; Stable with output capacitors as low as 1µF; Active Discharge; Output Voltage Options: 1.8V, 2.8V, 3.0V, 3.3V; Low Sleep Mode Current: Max. 1A; Current Limit Protection; Thermal Shutdown Protection; Output Current Limit: Min. 200mA; No-Load Ground Current of Typ. 70µA; Full-Load Ground Current of Typ. 75µA; Output voltage accuracy: ±2.5% over Load/Line Regulat

Low Quiescent Current Sleep Mode; HighSide and LowSide Drivers Connected in a HalfBridge Configuration; Integrated Freewheeling Protection (LS and HS); 0.55 A Peak Current; RDS(on) = 1 ohm (typ); Overcurrent Protection; Overtemperature Protection; Under Load Detection; Discriminated Fault Reporting; 16Bit Frame Detection; Daisy Chain Compatible with Multiple of 8 bit Devices; 5 MHz SPI Control; Compliance with 5 V and 3. 3 V Systems; Undervoltage and Overvoltage Lockout

SOIC-28

High Speed (up to 1 Mbps); Compatible with the ISO 11898−2 Standard; VIO Pin on NCV7351D13 Version Allowing Direct Interfacing with 3V to 5V Microcontrollers; EN Pin on NCV7351D1E Version Allowing Switching the transceiver to a Very Low Current OFF Mode; Excellent Electromagnetic Susceptibility (EMS) Level Over Full Frequency Range. Very Low Electromagnetic Emissions (EME) Low EME also Without Common Mode (CM) Choke; Bus Pins Protected Against >15 kV System ESD Pulses; Transmit Data (TxD) Dominant Time−out

High Speed (up to 1 Mbps); Compatible with the ISO 11898−2 Standard; VIO Pin on NCV7351D13 Version Allowing Direct Interfacing with 3V to 5V Microcontrollers; EN Pin on NCV7351D1E Version Allowing Switching the transceiver to a Very Low Current OFF Mode; Excellent Electromagnetic Susceptibility (EMS) Level Over Full Frequency Range. Very Low Electromagnetic Emissions (EME) Low EME also Without Common Mode (CM) Choke; Bus Pins Protected Against >15 kV System ESD Pulses; Transmit Data (TxD) Dominant Time−out

Low Electromagnetic Emission (EME) and Extremely High Electromagnetic Immunity; Compatible with the ISO 11898−5 Standard; High Speed (up to 1 Mbps); No Disturbance of the Bus Lines with an Un−powered Node; Transmit Data (TxD) Dominant Time−out Function; Very Low Current Standby Mode with Wake−up via the Bus; Very Low EME without Common−mode (CM) Choke; Under All Supply Conditions the Chip Behaves Predictably; Very High ESD Robustness of Bus Pins, >10 kV System ESD Pulses; Thermal Protection; Bus Pins Short

SOIC-14