Integrated Circuit

TSSOP-48

Use the download button to access the 74LCX02MTC schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 74ACT04MTC schematic symbol, PCB footprint, and 3D model.

TSSOP-14

TSSOP-20

Use the download button to access the DF50A-6P-1V(51) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the DF50A-5P-1H(51) schematic symbol, PCB footprint, and 3D model.

Hirose DF23C Series, 0.5mm Pitch 18 Way 2 Row Straight PCB Header, Solder Termination, 0.3A

Use the download button to access the DF11-14DP-2DS(52) schematic symbol, PCB footprint, and 3D model.

Dimensions: Dimensions 6.2 x 6.4 MM | Dimensions .24 x .25 INCH | Electrical Characteristics: Board Level Pressure Sensor Supply Voltage 1.8 – 3.6 V | Operation/Application: Resolution .024 | Pressure 2000 MBAR | Board Level Pressure Sensor Accuracy ±2.5mbar | Output/Span 24 bit ADC | Other: Sensor Options No Option | Packaging Features: Board Level Pressure Sensor Package Surface Mountable | Product Type Features: Board Level Pressure Sensor Type Digital Pressure and Altimeter Sensor Modules | Board Lev

Dimensions: Dimensions 3 x 3 x 0.9 MM | Dimensions .11 x .11 x 0.03 INCH | Electrical Characteristics: Board Level Pressure Sensor Supply Voltage 1.5 – 3.6 V | Operation/Application: Resolution .016 | Output/Span 24 bit ADC | Board Level Pressure Sensor Accuracy ±4mbar | Other: Sensor Options No Option | Packaging Features: Board Level Pressure Sensor Package Surface Mountable | Product Type Features: Board Level Pressure Sensor Style Absolute | Board Level Pressure Sensor Type Digital Pressure and Altim

TE Connectivity G-NICO-018 Temperature Sensor 16-Pin QFN16

Configuration Features: Number of Resistors 1 | Dimensions: Product Length .079 INCH | Product Width 1.25 MM | Product Height .022 INCH | Product Height .55 MM | Product Width .049 INCH | Product Length 2 MM | Electrical Characteristics: Resistance Value 34.8K OHM | Passive Component Tolerance .1 PCT | Power Rating .1 WATT | Resistance Class 1kΩ – 1MΩ | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Resistor Type Precision Resistor | Element Type Thin Film | Package Size Co

TE Connectivity Mod IV Series 8 Way 2 Row Female Straight PCB Connector Housing

Configuration Features: Number of Resistors 1 | Dimensions: Product Height .043 INCH | Product Length 6.35 MM | Product Height 1.1 MM | Product Length .25 INCH | Product Width 3.2 MM | Product Width .126 INCH | Electrical Characteristics: Power Rating 3 WATT | Resistance Class Up to 1kΩ | Resistance Value 82 OHM | Passive Component Tolerance 1 PCT | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 2512 | Resistor Type Power Resistor | Element Type Thick Film |

325535009-00, Barometric Pressure Sensor, 14bar 0 → 3.6 V Output, 8-Pin

Molex C-GRID III Series, Series Number 90131, 2.54mm Pitch 30 Way 2 Row Straight PCB Header, Solder Termination, 3A

Use the download button to access the 87438-1042 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 87438-0342 schematic symbol, PCB footprint, and 3D model.

UDA1334BTS/N2,112 is a NXP integrated circuit for embedded electronic designs. Key specs include 16 positions, 16 pins, -40°C to 85°C. Request quote for availability, lifecycle status, and worldwide shipping.

NXP TEA1733T/N1, SMPS Controller, 30 V, SMPS Controller, 71 kHz, 8-Pin, SOIC

TDA8551T/N1,112 is an NXP Class-AB mono audio amplifier with integrated digital volume control in an 8-pin SOIC package. It delivers up to 1 W output power with 0.15% THD from a 2.7 V to 5.5 V single supply. Available from authorized distributors with worldwide shipping.

Temperature Sensor Digital, Local -55°C ~ 125°C 13 b 8-TSSOP

HVQFN-16

8-bit I2C-bus and SMBus I/O port with interrupt

HVQFN-16

4-channel I2C-bus switch with interrupt logic and reset

NXP PCA9544APW,112, Multiplexer Single 4:1, 20-Pin TSSOP

HVQFN-20

PCA9505DGG_X2,112 is a Nexperia integrated circuit for PCB-level interconnects, replacement sourcing, or production BOMs. Key specs include 56 pins, Small Outline Packages. From inquiry pricing, in stock sourcing, and worldwide shipping support.

NXP LPC2387FBD100,551 is an integrated circuit for electronic assemblies. It is specified around 100 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT314-2, LQFP-64

LPC2132FBD64/01,15 is a 32-bit 512kB adc by NXP. Key specs: 32-bit, 512kB, 10-bit. From quote-based pricing, in stock with worldwide shipping for production sourcing for production BOM sourcing.

Single-chip 16/32-bit microcontrollers 32/64/128/256/512 kB ISP/IAP flash with 10-bit ADC and DAC

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT314-2, LQFP-64

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT-314-2, LQFP-64

NXP LPC2109FBD64/01,15, 16/32bit ARM7TDMI-S Microcontroller, 60MHz, 64 kB Flash, 64-Pin LQFP

7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48

28 X 28 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT459-1, LQFP-208

LQFP-100

NXP LPC1313FHN33,551, 32bit ARM Cortex M3 Microcontroller, 72MHz, 32 kB Flash, 33-Pin HVQFN

10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT314-2, LQFP-64

Use the download button to access the LPC1227FBD48/301,1 schematic symbol and PCB footprint.

Use the download button to access the LPC1225FBD48/301,1 schematic symbol and PCB footprint.

NXP LPC1113FBD48/301,1, 32bit ARM Cortex M0 Microcontroller, 50MHz, 24 kB Flash, 48-Pin LQFP

Use the download button to access the LPC1112FHN33/101,5 schematic symbol, PCB footprint, and 3D model.

SOP-14

NXP HEF4104BT, Logic Level Translator, Quad Low to High Voltage Translator, TTL to LOCMOS, 3-State

NXP HEF4082BP,652, AND Dual 4 Input AND, 3 → 15 V, 14-Pin PDIP

PLASTIC, SOT-108-1, SO-14