Connector
Connector components are essential building blocks in modern electronic systems. FindMyChip sources Connector ICs from authorized China distributors with competitive pricing and reliable stock.
50,999 components
How to Choose Connector Components
- 1Verify electrical specifications (voltage, current, frequency) match your design requirements.
- 2Check package footprint and thermal characteristics against your PCB layout constraints.
- 3Confirm lifecycle status and long-term availability for production designs.
Popular Applications
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Connector Guides & Articles
STM32H725IGT3 Selection Guide: Memory, Package, Temperature, and Supply
Choose the right STM32H725 variant by comparing Flash, package, pin count, temperature grade, connectivity, and production requirements.
Aug 1, 2026
STM32H725IGT3 High-Performance MCU Design Guide
Design STM32H725IGT3 systems for reliable 550 MHz operation with practical power, clock, cache, DMA, PCB, ADC, and recovery guidance.
Jul 31, 2026
150141VS73100 Violet SMD LED Selection Guide: Color, Drive, and Sourcing
Select the 150141VS73100 by wavelength, brightness, drive current, 3528 fit, reliability, and traceable sourcing requirements.
Jul 31, 2026
STEF05SGR 5 V eFuse Protection Design Guide
Design a reliable 5 V STEF05SGR eFuse stage with current-limit math, capacitor sizing, thermal analysis, fault recovery, and PCB layout guidance.
Jul 30, 2026
All Connector Components
Showing 4,051–4,100 of 50,999
Body Features: Connector Profile Standard | Primary Product Color Black | Shell Plating Material Nickel over Copper | Configuration Features: Number of Positions 68 | Number of Rows 4 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Palladium Nickel | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | PCB Contact Termin
TE Connectivity Amplimite .050 III Series 3.18mm Pitch 100 Way Right Angle PCB D-sub Connector,
Body Features: Mating Retention Feature Material Zinc | Primary Product Color Black | Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 25 | Contact Features: Contact Shape & Form Round | Contact Current Rating (Max) 2.7 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Cont
Body Features: Insert Material Zinc | Primary Product Color Black | Mating Retention Feature Material Zinc | Connector Profile Standard | Shell Plating Material Tin | Assembly Process Feature Material Brass | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Round | Contact Mating Area Plating Material Gold Flash | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Base
Body Features: Mating Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Mating Feature Plating Material Clear Chromate | Primary Product Color Black | Connector Profile Standard | Insert Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Positions 15 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Base Material Phosphor Bronze | Contact Curren
Body Features: Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contac
Body Features: Primary Product Color Black | Assembly Process Feature Material Copper Alloy | Connector Profile Standard | Insert Material Zinc | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Configuration Features: Number of Rows 2 | Number of Positions 15 | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Round | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash | Contact Base Material Brass | PCB Contact Termination Area
Body Features: Connector Profile Standard | Primary Product Color Black | Shell Plating Material Tin | Insert Material Zinc | Assembly Process Feature Material Copper Alloy | Configuration Features: Number of Positions 9 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Brass
Body Features: Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Mating Retention Feature Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 15 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | Contact Shape & Form Round | Contact Base Material Brass | Contact Underplating Material Palladium Nickel | PCB Contact Termination Are
Body Features: Insert Material Brass | Shell Plating Material Tin | Connector Profile Standard | Mating Retention Feature Material Brass | Primary Product Color Black | Configuration Features: Number of Positions 37 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating
Body Features: Mating Retention Feature Material Zinc | Shell Plating Material Tin over Copper | Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 9 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash | Contact Base Material Brass | Contact Shape & Form Round | Contact Underplating Material Nickel
Body Features: Mating Feature Material Zinc | Connector Profile Standard | Insert Material Zinc | Primary Product Color Black | Mating Feature Plating Material Clear Chromate | Shell Plating Material Tin over Copper | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 15 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Mater
Body Features: Mating Feature Material Steel | Primary Product Color Black | Insert Material Thermoplastic | Connector Profile High | Mating Feature Plating Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 3 | Contact Features: Contact Shape & Form Square | Contact Mating Area Plating Material Gold Flash | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 6 AMP | Contact Underplating Material N
5747020-1 is a TE Connectivity connector for PCB interconnect and production BOM sourcing. Key specs include 9 pins, 0.494 inch pitch, -55°C to 105°C operating range. From inquiry pricing, in stock sourcing, and worldwide shipping support.
Body Features: Connector Profile Standard | Insert Material Brass | Shield Material Steel | Mating Retention Feature Material Brass | Shell Plating Material Tin | Primary Product Color Black | Shield Plating Material Tin | Configuration Features: Number of Positions 25 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material
Body Features: Primary Product Color Black | Shield Plating Material Tin | Mating Retention Feature Material Brass | Shield Material Steel | Connector Profile Standard | Shell Plating Material Tin | Insert Material Brass | Configuration Features: Number of Positions 25 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Shape & Form Round | Contact Mating Area Plating Material Gold Flash | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Co
Body Features: Connector Profile Standard | Insert Material Zinc | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Configuration Features: Number of Positions 37 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Contact Shape & Form Round | PCB Contact Termination Area Plating Material
Body Features: Mating Feature Material Zinc | Mating Feature Plating Material Clear Chromate | Shell Plating Material Tin | Insert Material Zinc | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 25 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Gold Flash | Contact Base Material Phosphor Bronze | Contact Shape & Form Round | Dimens
Body Features: Mating Feature Material Zinc | Mating Feature Plating Material Clear Chromate | Connector Profile Standard | Insert Material Zinc | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 15 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Base Material Phosphor Bronze | Contact Shape & Form Round | Contact Mati
Body Features: Connector Profile Standard | Insert Material Thermoplastic | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: Number of Positions 50 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Shape & Form Square | Contact Mati
Body Features: Insert Material Thermoplastic | Connector Profile Standard | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: Number of Positions 15 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Shape & Form Square | Contact Current Rating (Max) 6 AMP | Cont
Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 9 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Dimensions: PCB Thickness (Recommended) .093 INCH | Row-to-Row Spacing
Body Features: Connector Profile High | Shell Plating Material Tin | Insert Material Thermoplastic | Configuration Features: Number of Positions 50 | Number of Rows 3 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Shape & Form Square | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Base Material Phosphor Bronze | Dimensions: Row-to-Row Spacing .112 INCH
Body Features: Mating Feature Material Brass | Mating Feature Plating Material Nickel over Copper Flash | Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 37 | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Contact Sh
Body Features: Mating Feature Material Brass | Primary Product Color Black | Mating Feature Plating Material Nickel over Copper Flash | Connector Profile Standard | Configuration Features: Number of Positions 15 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contac
Body Features: Primary Product Color Black | Mating Retention Feature Material Brass | Connector Profile Standard | Configuration Features: Number of Positions 15 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Underplating Material Nickel | Contact Base Material Phosphor Bronze | Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area P
Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 9 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Base Material Brass | Contact Shape & Form Square | Contact Mating Area Plating Material Gold Flash | Dimensions: PCB Thickness (Recommended) .062 INCH | Row-to-Row Spacing 2.84 MM
Body Features: Primary Product Color Gray | Configuration Features: Mating & Unmating Configuration Make First / Break Last | Number of Positions 64 | PCB Mount Orientation Vertical | Number of Signal Positions 64 | Rows Loaded C | Number of Columns 32 | Number of Rows 3 | Rows Loaded A | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.3 MICM
Use the download button to access the 5650933-5 schematic symbol, PCB footprint, and 3D model.
LEAD FREE
LEAD FREE
Configuration Features: Number of Signal Positions 64 | PCB Mount Orientation Right Angle | Rows Loaded A | Number of Rows 3 | Number of Positions 64 | Number of Columns 32 | Rows Loaded C | Dimensions: Row-to-Row Spacing .1 INCH | Row-to-Row Spacing 2.54 MM | Housing Features: Centerline (Pitch) 2.54 MM | Centerline (Pitch) .1 INCH | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Application: Circuit Application Signal | Product Type Features: Connector System Board-to-Board | Conne
Body Features: Primary Product Color Gray | Configuration Features: Number of Signal Positions 48 | PCB Mount Orientation Right Angle | Number of Positions 48 | Rows Loaded C | Rows Loaded B | Rows Loaded A | Number of Rows 3 | Number of Columns 16 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating
Body Features: Primary Product Color Gray | Configuration Features: Number of Signal Positions 64 | Number of Rows 2 | Rows Loaded A, B | PCB Mount Orientation Vertical | Number of Positions 64 | Number of Columns 32 | Contact Features: Contact Mating Area Plating Material Gold | Contact Type Socket | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material T
Body Features: Primary Product Color Gray | Configuration Features: PCB Mount Orientation Vertical | Number of Columns 16 | Number of Positions 32 | Number of Signal Positions 32 | Number of Rows 2 | Rows Loaded A, B | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Layout Inline | PCB Contact Termination Area Plating Material Thickness 100 – 200 MICIN | Contact Ma
5646956-1 is a TE Connectivity connector for PCB interconnect and production BOM sourcing. Key specs include 24 pins, -55°C to 125°C operating range. From inquiry pricing, in stock sourcing, and worldwide shipping support.
TE Connectivity HM Series 2mm 176 Way 8 Row Right Angle PCB Socket Through Hole Free Board
ROHS COMPLIANT
TE Connectivity Z-PACK HM Series 2mm Pitch Hard Metric Type D Backplane Connector, Female, Right Angle, 25 Column
Body Features: Primary Product Color Gray | Configuration Features: Backplane Architecture Mezzanine | Rows Loaded A | Number of Rows 10 | Rows Loaded H | Rows Loaded E | PCB Mount Orientation Vertical | Rows Loaded B | Rows Loaded Z | Rows Loaded D | Rows Loaded I | Number of Signal Positions 200 | Rows Loaded C | Number of Columns 25 | Number of Positions 250 | Rows Loaded F | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1.5 AMP | PCB Contact Termination Area
Use the download button to access the 5646346-1 schematic symbol, PCB footprint, and 3D model.
Body Features: Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Copper | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Number of Loaded Positions 8 | Number of Positions 8 | Number of PCB Ground Tabs 6 | Connector Contact Density Standard | Status Light Type Not Illuminated | Port Matrix Configuration 2 x 8 | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | PCB Mo
Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | Shield Plating Material Tin over Copper | Grounding Tab Plating Material Tin over Copper | Shield Material Copper Alloy | Configuration Features: Number of Positions 8 | Multiple Port Configuration Stacked | Port Configuration Multiple Ports | Status Light Type Not Illuminated | Number of Loaded Positions 8 | Connector Contact Density Standard | Port Matrix Configuration 2 x 6 | PCB Mount Orientation Right Angle |
Body Features: Shield Plating Material Tin over Copper | Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Grounding Tab Plating Material Tin over Copper | Configuration Features: Status Light Type Not Illuminated | Number of Loaded Positions 8 | Number of PCB Ground Tabs 6 | Port Matrix Configuration 2 x 3 | Connector Contact Density Standard | Number of Positions 8 | Port Configuration Multiple Ports | PCB Mount Orientation Right Angle | Multiple
Body Features: Shield Material Copper Alloy | Shield Plating Material Tin over Copper | Modular Jack Latch Orientation Standard - Latch Down | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Status Light Type Not Illuminated | Port Configuration Multiple Ports | Multiple Port Configuration Stacked | Number of Positions 8 | Connector Contact Density Standard | Number of PCB Ground Tabs 13 | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Por
Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Shield Material Copper Alloy | Grounding Tab Plating Material Tin over Copper | Shield Plating Material Tin over Copper | Configuration Features: Number of PCB Ground Tabs 9 | PCB Mount Orientation Right Angle | Port Matrix Configuration 2 x 4 | Multiple Port Configuration Stacked | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Multiple Ports | Connect
Body Features: Shield Plating Material Nickel | Connector Profile Standard | Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location 4.57 MM | PCB Ground Tab Location .18 INCH | Configuration Features: Number of Loaded Positions 8 | Connector Contact Density Standard | Status Light Type Not Illuminated | Multiple Port Configuration Ganged | Port Configuration Multiple Ports | Port Matrix Configuration 1 x 4 | Number of Panel Ground Tabs 6 | Number of PCB
Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Standard | Configuration Features: Connector Contact Density Standard | Port Configuration Multiple Ports | Number of Positions 8 | Port Matrix Configuration 1 x 5 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Multiple Port Configuration Ganged | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Base Material Phosphor Bronze | C
Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Loaded Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Thickness 50 MICIN
Body Features: Shield Plating Material Nickel over Copper | Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Zinc | Configuration Features: Number of Positions 50 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material