TE Connectivity
TE Connectivity is a leading electronic component manufacturer. FindMyChip sources TE Connectivity ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
8,050
Total Products
24
Categories
All TE Connectivity Components
Showing 3,601–3,650 of 8,050
Configuration Features: Number of Positions 16 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Dimensions: Row-to-Row Spacing 3 MM | Product Width 16.89 MM | Wire Size .051 – .517 MMSQ | Product Length 24.85 MM | Connector Height 6.86 MM | Compatible Insulation Diameter (Max) .06 INCH | Row-to-Row Spacing .118 INCH | Wire Size 30 – 20 AWG | Compatible Insulation Diameter (Max) 1.52 MM | Electrical Characteristics:
Configuration Features: Number of Rows 2 | Number of Positions 18 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | Dimensions: Compatible Insulation Diameter (Max) 1.52 MM | Row-to-Row Spacing .118 INCH | Panel Thickness (Recommended) .062 – .091 INCH | Product Length 16.89 MM | Connector Height 6.86 MM | Panel Thickness (Recommended) 1.57 – 2.3 MM | Compatible Insulation Diameter (Max) .6 INCH | Row-to-Row Spacing 3 MM | Product Width 7.11 MM | Electrical Characteristic
Configuration Features: Number of Positions 14 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Type Pin | Dimensions: Row-to-Row Spacing .118 INCH | Compatible Insulation Diameter (Max) 1.52 MM | Panel Thickness (Recommended) .062 – .091 INCH | Product Width 16.89 MM | Compatible Insulation Diameter (Max) .06 INCH | Row-to-Row Spacing 3 MM | Connector Height 8.71 MM | Product Length 18.85 MM | Panel Thickness (Recommended) 1.57 – 2.3 MM | Electrical Characterist
MATE-N-LOK, 1-794613-1 Series Number PCB Connector Contact, Male, Crimp, Gold Plating 30 → 26 AWG
Contact Features: Contact Current Rating (Max) 5 AMP | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Contact Retention Within Housing With | Mating Square Post Dimension .025 INCH | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .38 MICM | Mating Square Post Dimension .64 MM | Wire Contact Termination Area
Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Square Post Dimension .025 INCH | Wire Contact Termination Area Plating Material Tin | Mating Square Post Dimension .64 MM | Contact Underplating Material Thickness 50 MICIN | Wire Contact Terminati
Contact Features: Mating Pin Diameter .039 INCH | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 2.54 – 6.35 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Thickness 100 – 250 MICIN | Contact Mating Area Plating Material Gold | Contact Retention Within Hou
Contact Features: Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 100 – 250 MICIN | Contact Type Socket | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Finish Matte | Wire Contact Termination Area Plating Thickness 2.54 – 6.35 MICM | Mating Pin Diameter .039 INCH | Contact Orientation Straight | Contact M
Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Retention Within Housing Without | Contact Type Socket | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thick
Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Brass | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Gold | Contact Orientation Straight | Mating Pin Diameter 1 MM | Contact Current Rating (Max) 10.5 AMP | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Mating Pin Diameter .039 INCH | Contact Retention Within Housing Without | Wire Contact Termination Area Plating
Use the download button to access the 1-776231-1 schematic symbol, PCB footprint, and 3D model.
Contact Features: Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Tin | Contact Type Socket | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 50 MICIN | Mating Pin Diameter 1 MM | Contact Current Rating (Max
Contact Features: Mating Pin Diameter .039 INCH | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Type Pin | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Nickel | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Orientation Straight | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .
TE Connectivity Mini-Universal MATE-N-LOK, Mini-Universal MATE-N-LOK 2 Series, 4.14mm Pitch 12 Way 2 Row Right Angle
Configuration Features: Number of Positions 8 | PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Power Positions 8 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 9.5 AMP | Multiple Contact Types Without | Contact Mating Area Plating Materia
TE Connectivity Mini-Universal MATE-N-LOK, Mini-Universal MATE-N-LOK 2 Series, 4.14mm Pitch 8 Way 2 Row Right Angle
Contact Features: Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 50 MICIN | Mating Pin Diameter 1 MM | Contact Mating Area Plating Material Gold | Contact Retention Within Housing With | Contact Orientation Straight | Mating Pin Diameter .039 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Brass | Wire Con
PCB Connector Contact, Female, Crimp, Gold over Nickel Plating 22 → 26 AWG
ROHS COMPLIANT
Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 11 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Retention Within Housing Without | Contact Current Rating (Max) 6.5 AMP | Contact Type Socket | Dimensions: Wire Size 30 – 18 AWG | Wire Size .0509 – .823 MMSQ | Connector Length 1.715 INCH | Connector Height .25 INCH | Electrical Characteristics: Operating Voltage 250 VAC | Housing Features: Housing Material Nylon - GF | Centerline (Pitch)
TE Connectivity Mini-Universal MATE-N-LOK, Mini-Universal MATE-N-LOK 2 Series, 4.14mm Pitch 10 Way 2 Row Straight
Contact Features: Contact Current Rating (Max) 13 AMP | Mating Pin Diameter 2.18 MM | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Pin Diameter .086 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area
Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Orientation Straight | Contact Type Pin | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter 2.18 MM | Contact Retention Within Housing Without | Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Pin Diameter .086 INCH | Contact Underplating Material Thickness 1.27 MICM | Contact Base Material Brass | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 7 AMP |
Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Nickel | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Material Finish Matte | Contact Current Rating (Max) 17 AMP | Mating Pin Diameter 2.18 MM | Contact Type Socket | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter .086 INCH | Contact Orientation Straight | Contact Base Material Phosph
Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Current Rating (Max) 7 AMP | Mating Pin Diameter .086 INCH | Contact Orientation Straight | Contact Type Pin | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Tin | Mating Pin Diameter 2.18 MM | Contact Base Material Brass | C
Contact Features: Wire Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Retention Within Housing Without | Contact Underplating Material Thickness 1.27 MICM | Mating Pin Diameter .086 INCH | Contact Orientation Straight | Mating Pin Diameter 2.18 MM | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Current Rating (Max) 7 AMP | Contact Underplating Material Thickness 50 MICIN | Wire Contact Terminati
Contact Features: Contact Current Rating (Max) 7 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Retention Within Housing Without | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Nickel | Mating Pin Diameter 2.18 MM | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Mating Area Plating Materi
Contact Features: Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Mating Pin Diameter 2.18 MM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Base Material Brass | Mating Pin Diameter .086 INCH |
Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 3 – 6 MICIN | Contact Retention Within Housing Without | Contact Orientation Straight | Contact Underplating Material Thickness 1.27 MICM | Contact Underplating Material Thickness 50 MICIN | Mating Pin Diameter .086 INCH | Wire Contact Termination Area Plating Material Tin | Contact Type Socket | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Current Rating (Max) 7 AMP | Contact Ma
Contact Features: Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Material Finish Bright | Contact Orientation Straight | Mating Pin Diameter 1.57 MM | Contact Underplating Material Thickness 50 MICIN | Contact Base Material Copper Nickel Alloy | Contact Mating Area Plating Material Thickness 100 MICIN | Wire C
Contact Features: Wire Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 100 MICIN | Mating Pin Diameter .062 INCH | Wire Contact Termination Area Plating Thickness 2.54 MICM | Mating Pin Diameter 1.57 MM | Contact Size Size 16 | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 1
Contact Features: Contact Orientation Straight | Contact Underplating Material Thickness 50 MICIN | Contact Base Material Copper Nickel Alloy | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 5 – 8 MICIN | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Materi
Contact Features: Contact Orientation Straight | Barrel Type Open | Contact Underplating Material Thickness .76 MICM | Contact Underplating Material Thickness 30 MICIN | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 2.54 MICM | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Nickel | Mating Pin Diameter .062 INCH | Mating Pin Diameter 1.57 MM | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Tin | Co
Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Base Material Brass | Contact Underplating Material Thickness 30 MICIN | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Material Finish Bright | Cont
Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Wire Contact Termination Area Plating Material Tin | Contact Underplating Material Thickness 50 MICIN | Contact Underplating Material Nickel | Contact Current Rating (Max) 13 AMP | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter 1.57 MM | Wire Contact Termination Area Plating Material Finish Matte | Contact Orientation Straigh
Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Finish Bright | Contact Base Material Brass | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 100 MICIN | Contact
Body Features: Primary Product Color Blue | Configuration Features: Number of Positions 26 | PCB Mount Orientation Vertical | Number of Rows 4 | Contact Features: Wire Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Wire
Configuration Features: Number of Rows 9 | Number of Signal Positions 36 | Number of Positions 36 | Number of Power Positions 0 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Contact Type Socket | Dimensions: Product Width 1.83 INCH | Row-to-Row Spacing .165 INCH | Product Width 46.48 MM | Wire Size 26 – 18 AWG | Row-to-Row Spacing 4.19 MM | Compatible Insulation Diameter Range 2.92 MM | Connector Height 12.95 MM | Product Length 21.34 MM | Wire Size .12 â
Configuration Features: Number of Rows 6 | Number of Signal Positions 24 | Number of Power Positions 0 | Number of Positions 24 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Dimensions: Row-to-Row Spacing 4.19 MM | Row-to-Row Spacing .165 INCH | Product Width 33.91 MM | Wire Size 26 – 18 AWG | Product Width 1.335 INCH | Connector Height .51 INCH | Compatible Insulation Diameter Range 2.92 MM | Product Length .84 INCH | Compatible Ins
Configuration Features: Number of Power Positions 0 | Number of Signal Positions 20 | Number of Rows 5 | Number of Positions 20 | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 9 AMP | Contact Type Socket | Dimensions: Row-to-Row Spacing 4.19 MM | Connector Height .51 INCH | Product Width 29.72 MM | Wire Size 26 – 18 AWG | Compatible Insulation Diameter Range 2.92 MM | Compatible Insulation Diameter Range .115 INCH | Wire Size .12 – .8 MMSQ | Product Width 1.17 IN
Configuration Features: Number of Rows 5 | Number of Signal Positions 15 | Number of Positions 15 | Number of Power Positions 0 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Type Socket | Contact Retention Within Housing With | Dimensions: Product Length .84 INCH | Connector Height 12.95 MM | Product Width 1.17 INCH | Compatible Insulation Diameter Range 2.92 MM | Product Length 21.34 MM | Product Width 29.72 MM | Row-to-Row Spacing 4.19 MM | Wire Size 26 – 18 AWG | Wire Size .12 – .8
Configuration Features: Number of Signal Positions 12 | Number of Power Positions 0 | Number of Positions 12 | Number of Rows 4 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Type Socket | Contact Retention Within Housing With | Dimensions: Row-to-Row Spacing .165 INCH | Compatible Insulation Diameter Range 2.92 MM | Product Width 1.17 INCH | Wire Size 26 – 18 AWG | Connector Height 12.95 MM | Connector Height .51 INCH | Product Length 21.34 MM | Product Width 25.53 MM | Row-to-Row Spaci
Configuration Features: Number of Signal Positions 36 | Number of Rows 9 | Number of Positions 36 | Number of Power Positions 0 | Contact Features: Contact Retention Within Housing With | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Dimensions: Connector Height .29 INCH | Row-to-Row Spacing 4.19 MM | Product Length 1.06 INCH | Product Width 46.48 MM | Connector Height 7.37 MM | Wire Size .12 – .8 MMSQ | Product Length 26.92 MM | Wire Size 26 – 18 AWG | Compatible Insulation Diameter Range .11
TE Connectivity MR II Series 24 Way 6 Row Female Straight PCB Connector Housing
Configuration Features: Number of Signal Positions 20 | Number of Rows 5 | Number of Positions 20 | Number of Power Positions 0 | Contact Features: Contact Retention Within Housing With | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Dimensions: Product Width 29.72 MM | Wire Size 26 – 18 AWG | Product Length 26.92 MM | Product Width 1.17 INCH | Compatible Insulation Diameter Range 2.92 MM | Connector Height 7.37 MM | Row-to-Row Spacing .165 INCH | Product Length 1.06 INCH | Compatible Insulation
Configuration Features: Number of Positions 15 | Number of Power Positions 0 | Number of Rows 5 | Number of Signal Positions 15 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing With | Dimensions: Wire Size .12 – .8 MMSQ | Product Length 1.06 INCH | Row-to-Row Spacing 4.19 MM | Product Length 26.92 MM | Compatible Insulation Diameter Range 2.92 MM | Wire Size 26 – 18 AWG | Connector Height 7.37 MM | Product Width 29.72 MM | Connector Height .29
TE Connectivity MTA Series, 2.54mm Pitch 12 Way 1 Row Right Angle PCB Header, Solder, Through Hole Termination, 5A
Use the download button to access the 1-1939638-3 schematic symbol, PCB footprint, and 3D model.
Use the download button to access the 1-534206-3 schematic symbol, PCB footprint, and 3D model.
TE Connectivity AMP LATCH Series, 2.54mm Pitch 50 Way 2 Row Straight PCB Header, Solder Termination
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