TE Connectivity
TE Connectivity is a leading electronic component manufacturer. FindMyChip sources TE Connectivity ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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All TE Connectivity Components
Showing 2,701–2,750 of 8,050
Configuration Features: Number of Rows 1 | Number of Power Positions 5 | PCB Mount Orientation Right Angle | Number of Positions 5 | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Dimensions: Compatible Insulation Diameter Range .047 – .122 INCH | Compatible Insulation Diameter (Max) 2.39 INCH | Product Width .49 INCH |
Configuration Features: Number of Signal Positions 4 | Number of Positions 4 | Contacts Preloaded Yes | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing With | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Layout Inline | Dimensions: Product Width 12.45 MM | Connector Height 5.4 MM | Compatible Insulation Diameter Range 1.2 – 3.1 MM | Pro
Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | Contact Features: Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Dimensions: Connector Height 5.4 MM | Product Length .543 INCH | Compatible Insulation Diameter (Max) 2.39 INCH | Compatible Insulation Diamete
Configuration Features: Number of Positions 5 | PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Power Positions 5 | Number of Rows 1 | Contact Features: Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Dimensions: Compatible Insulation Diameter Range 1.2 – 3.1 MM | Product Length 22.2 MM | PCB Thickness (Recomm
Configuration Features: Number of Signal Positions 0 | Number of Power Positions 4 | Number of Positions 4 | PCB Mount Orientation Right Angle | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Dimensions: Product Length 18 MM | Compatible Insulation Diameter (Max) 2.39 INCH | PCB Thickness (Recommended)
Configuration Features: Number of Positions 3 | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 3 | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Dimensions: Compatible Insulation Diameter Range .047 – .122 INCH | Compatible Insulation Diameter Range 1.2 â
Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | Number of Power Positions 5 | Number of Rows 1 | Number of Signal Positions 0 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Layout Inline
Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Signal Positions 0 | Number of Positions 4 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin
Configuration Features: Number of Signal Positions 0 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin
Configuration Features: Contacts Preloaded Yes | Number of Positions 5 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .069 INCH | Product Width 5.4 MM | PCB Thickness (Recommended) 1.78 MM | Product Length .874 INCH | Product Length 22.2 MM | Product Width .213 INCH | Con
TE Connectivity 2029056-4 is a connector for electronic assemblies. It is specified around 4 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.
Configuration Features: Number of Positions 3 | Number of Power Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Type Pin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Dimensions:
Configuration Features: Number of Rows 1 | Number of Positions 5 | Number of Signal Positions 0 | Number of Power Positions 5 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Current Rating (Max) 9 AMP | Contact Layout Inline
TE Connectivity 2029054-4 is a connector for electronic assemblies. It is specified around 4 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.
Configuration Features: Number of Power Positions 3 | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Signal Positions 0 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 80 – 200 MICIN | Contact Current Rating (Max) 9 AMP | Contact Layout Inline | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM | Contact Mating Area Plat
Body Features: Primary Product Color Black | Primary Product Material Phenolic | Configuration Features: Number of Positions 4 | Contact Features: Contact Type Receptacle | Packaging Features: Packaging Quantity 45 | Product Type Features: Rectangular Connector Insert Type Insert for Contacts |
Contact Features: Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 2.54 MICM | Wire Contact Termination Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 2.54 MICM | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Base Material Brass | Contact Underplating Material Nickel | Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Barrel Type Open | Contact Mating Area Plating Material Tin | Mating Pin Di
Contact Features: Contact Orientation Straight | Wire Contact Termination Area Plating Thickness 2.54 MICM | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Size Size 16 | Wire Contact Termination Area Plating Material Finish Bright | Contact Current Rating (Max) 13 AMP | Mating Pin Diameter 1.57 MM | Contact Underplating Material Thickness 1.27 MICM | Contact Underpla
Contact Features: Wire Contact Termination Area Plating Material Tin-Lead | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 100 MICIN | Contact Size Size 16 | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Base Material Brass | Mating Pin Diameter 1.57 MM | Contact Current Rating (Max) 13 AMP | Contact Underplating Material Nick
Contact Features: Contact Orientation Straight | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing With | Mating Pin Diameter .062 INCH | Wire Contact Termination Area Plating Material Gold | Contact Base Material Brass | Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness 50 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness .76 MICM | Mating Pin Diameter 1.57 MM | Wir
Contact Features: Contact Base Material Brass | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness 50 MICIN | Contact Type Socket | Mating Pin Diameter .062 INCH | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness .76 MICM | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Mating Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 30 MICIN | Wir
Body Features: Connector Profile Standard | Shell Plating Material Nickel over Copper | Configuration Features: Number of Positions 4 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Current Rating (Max) 1.5 AMP | Housing Features: Body Orientation Straight | Housing Color Black | Housing Material Plastic | Industry Standards: IP Rating IP20 | Indu
Configuration Features: Number of Signal Positions 50 | Number of Positions 50 | Number of Power Positions 50 | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | Dimensions: Connector Height 65.91 MM | Wire Size .05 – 2 MMSQ | Row-to-Row Spacing 4.57 MM | Wire Size 30 – 14 AWG | Row-to-Row Spacing .18 INCH | Product Width 19.05 MM | Product Length .915 INCH | Connector Height 2.595 INCH | Product Length 23.24 MM | Produc
Configuration Features: Number of Power Positions 14 | Number of Positions 20 | Number of Signal Positions 14 | Number of Rows 4 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Dimensions: Connector Height 1.56 INCH | Product Width .44 INCH | Row-to-Row Spacing 3.3 MM | Row-to-Row Spacing .13 INCH | Wire Size 30 – 14 AWG | Product Width 11.18 MM | Wire Size .05 – 2 MMSQ | Product Length .915 INCH | Connector Height 39.62 MM | Product L
Body Features: Header Mating Direction Horizontal | Primary Product Color White | Configuration Features: Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICM | Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 3 MICM | PCB Contact Termination Area Plating Material Thickness 118.11 MICIN | Contact Layout Inline | Contact Current Rating (Max) 4 AMP | Contact Fabricat
Body Features: Heat Sink Height Class Networking Short | Heat Sink Height 4.2 MM | Heat Sink Style Pin | Heat Sink Height .165 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP
Body Features: Heat Sink Style Pin | Heat Sink Height .531 INCH | Heat Sink Height Class Networking Tall | Heat Sink Height 13.5 MM | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP
Configuration Features: Port Matrix Configuration 2 x 6 | Number of Positions 240 | Number of Ports 12 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Center
Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage Ma
Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent
Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External EMI Springs | Packaging Features: Packaging Method Box | Product Type Features: Se
Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent
Configuration Features: Number of Power Positions 34 | Number of Signal Positions 34 | Number of Rows 4 | Number of Positions 34 | Contact Features: Contact Retention Within Housing With | Contact Type Socket | Contact Current Rating (Max) 13 AMP | Dimensions: Connector Height 50.8 MM | Row-to-Row Spacing .18 INCH | Product Length 23.24 MM | Connector Height 1.999 INCH | Product Width 19.05 MM | Product Length .915 INCH | Wire Size .05 – 2 MMSQ | Wire Size 30 – 14 AWG | Product Width .75 INCH | Row-to-R
Configuration Features: Number of Positions 75 | Number of Power Positions 75 | Number of Signal Positions 75 | Number of Rows 6 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Dimensions: Wire Size 30 – 14 AWG | Row-to-Row Spacing 4.57 MM | Product Width 1.11 INCH | Wire Size .05 – 2 MMSQ | Product Length .915 INCH | Connector Height 65.91 MM | Product Length 23.24 MM | Product Width 28.19 MM | Row-to-Row Spacing .18 INCH | Connector
Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible No | Pluggable I/O Applications SFP+ | Other: EMI Containment Feature Type Internal/External EMI Springs | Included Lightpipe No | Packaging Features: Pac
Body Features: Heat Sink Style Pin | Heat Sink Height Class Networking Tall | Heat Sink Height 6.5 MM | Heat Sink Height .256 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | Circuit Application Signal
Configuration Features: Number of Ports 1 | Port Matrix Configuration 1 x 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External EMI Springs | Packaging Features: Packaging Method Tray | Product Type Features: S
Configuration Features: Number of Positions 75 | Number of Signal Positions 75 | Number of Power Positions 75 | Number of Rows 6 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Dimensions: Connector Height 65.91 MM | Product Width 28.19 MM | Row-to-Row Spacing .18 INCH | Connector Height 2.595 INCH | Product Length 23.24 MM | Row-to-Row Spacing 4.57 MM | Wire Size 30 – 14 AWG | Product Width 1.11 INCH | Product Length .915 INCH | Wire
Configuration Features: Number of Ports 12 | Number of Positions 240 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage
Body Features: Heat Sink Height 4.2 MM | Heat Sink Style Pin | Heat Sink Height Class PCI | Heat Sink Height .165 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | Circuit Application Signal | Other: Inc
TE Connectivity 2007042-1 is a connector for electronic assemblies. It is specified around 64 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.
Configuration Features: Number of Signal Positions 26 | Number of Rows 4 | Number of Positions 26 | Number of Power Positions 26 | Contact Features: Contact Type Socket | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | Dimensions: Wire Size .05 – 2 MMSQ | Product Width 14.22 MM | Wire Size 30 – 14 AWG | Product Width .56 INCH | Connector Height 1.63 INCH | Row-to-Row Spacing .13 INCH | Product Length .915 INCH | Row-to-Row Spacing 3.3 MM | Product Length 23.24 MM | Connecto
Configuration Features: Number of Rows 3 | Number of Positions 20 | Number of Power Positions 20 | Number of Signal Positions 20 | Contact Features: Contact Type Socket | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | Dimensions: Product Width .44 INCH | Wire Size 30 – 14 AWG | Row-to-Row Spacing 3.3 MM | Product Length .915 INCH | Product Width 11.18 MM | Product Length 23.24 MM | Row-to-Row Spacing .13 INCH | Connector Height 39.62 MM | Wire Size .05 – 2 MMSQ | Connector
Contact Features: Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Gold | Wire Contact Termination Area Plating Thickness .8 – 1.4 MICM | Contact Type Socket | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Size Size 16 | Contact Base Material Brass | Contact Mating Area Plating Material Thickness .8 – 1.4 MICM | Contact Orientation Straight | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness 1.27 MICM | Contact U
Body Features: Primary Product Material Aluminum | Configuration Features: Number of MT Ferrule Cavities 2 | Product Type Features: Fiber Optic Connector Type Module (Daughtercard) Kit | Fiber Optic Product Type Connector Kit | Usage Conditions: Operating Temperature Range -40 – 85 DEGC |
Body Features: Terminal Seal Type Single Wire Seal (SWS) | Contact Features: Mating Tab Width 2.8 MM | Crimp Type F-Crimp | Wire Contact Termination Area Plating Material Tin | Mating Tab Width .11 INCH | Contact Size 2.8mm | Typical Current Rating 30 AMP | Interface Plating Tin (Sn) | Terminal Type Tab | Contact Fabrication Stamped & Formed | Mating Tab Thickness .8 MM | Mating Tab Thickness .031 INCH | Dimensions: Wire Size Search 22 AWG | Wire Size Search .5 MMSQ | Wire Size .2 – .5 MMSQ | Wire Size Se
Body Features: Terminal Seal Type Single Wire Seal (SWS) | Contact Features: Contact Fabrication Stamped & Formed | Terminal Type Tab | Mating Tab Width 2.8 MM | Typical Current Rating 30 AMP | Contact Size 2.8mm | Mating Tab Thickness .8 MM | Mating Tab Thickness .031 INCH | Interface Plating Tin (Sn) | Crimp Type F-Crimp | Mating Tab Width .11 INCH | Wire Contact Termination Area Plating Material Tin | Dimensions: Wire Size Search 18 AWG | Wire Size Search 19 AWG | Compatible Insulation Diameter Range 3.4
Body Features: Primary Product Color Black | Configuration Features: Number of Positions 30 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Base Material Beryllium Copper | Contact Type Socket | Dimensions: Connector Length 1.5 INCH | Connector Length 38.1 MM | Row-to-Row Spacing 2.54 MM | Row-to-Row Spacing .1 INCH | Connector Height .24 INCH | Connector Height 3.14 MM | Electrical Characteristics: Termination Resistance 12 MOHM | Operating Voltage 250 VAC | Insulation R
Body Features: Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 26 | Contact Features: Contact Type Socket | Contact Base Material Beryllium Copper | Contact Current Rating (Max) 3 AMP | Dimensions: Row-to-Row Spacing 2.54 MM | Connector Length 33.02 MM | Connector Length 1.3 INCH | Connector Height .24 INCH | Row-to-Row Spacing .1 INCH | Connector Height 6.1 MM | Electrical Characteristics: Dielectric Withstanding Voltage (Max) 750 V | Operating Voltage 250 VAC |
Body Features: Primary Product Color Black | Configuration Features: Number of Positions 24 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 3 AMP | Contact Type Socket | Contact Base Material Beryllium Copper | Dimensions: Connector Height 3.14 MM | Connector Length 1.2 INCH | Row-to-Row Spacing .1 INCH | Row-to-Row Spacing 2.54 MM | Connector Length 30.48 MM | Connector Height .24 INCH | Electrical Characteristics: Operating Voltage 250 VAC | Insulation Resistance 5000 MEGO | Dielectric
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