TE Connectivity

Contact Features: Contact Type Tab | Wire Contact Termination Area Plating Thickness .76 MICM | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper | Contact Orientation Right Angle | Wire Contact Termination Area Plating Material Finish Bright | Mating Tab Width .23 INCH | Contact Underplating Material Copper | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Pl

Contact Features: Wire Contact Termination Area Plating Material Finish Matte | Contact Type Pin | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Size Size 16 | Wire Contact Termination Area Plating Material Tin | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Precious Metal | Wire Contact Termination Area Plating Thickness 50 MICIN | Cont

Contact Features: Contact Base Material Brass | Contact Size Size 16 | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Retention Within Housing With | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Orientation Straight

Contact Features: Contact Type Pin | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness 10

Contact Features: Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Size Size 16 | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter .062 INCH | Contact Orientation Straight | Contact Retention Within Housing With | Contact Base Materi

Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Underplating Material Nickel | Contact Orientation Straight | Contact Size Size 16 | Contact Underplating Material Thickness 30 MICIN | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Retention Within Housing With | C

Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Finish Bright | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Finish Bright | Contact Underplating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Retention W

Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Finish Matte | Contact Orientation Straight | Mating Pin Dia

Contact Features: Contact Size Size 16 | Wire Contact Termination Area Plating Material Gold | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Orientation Straight | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness .76 MICM | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness .25 M

Contact Features: Wire Contact Termination Area Plating Material Gold | Wire Contact Termination Area Plating Material Finish Bright | Contact Type Pin | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Current Rating (Max) 13 AMP | Contact Orientation Straight | Contact Underplating Material Nickel | Contact Retention Within Housing With | Contact Underplating Material Thickness 50 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Mating Are

Contact Features: Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Retention Within Housing With | Contact Orientation Straight | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Size Size 16 | Contact Mating Area Plating Material Precious Metal | Conta

Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Base Material Brass | Contact Type Pin | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Nickel | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Size Size 16 |

TE Connectivity 650946 Series 32 Way 2.54mm Pitch, Type C Class C2, 2 Row a, c, Right Angle DIN 41612 Connector, Plug

Configuration Features: Number of Columns 32 | Number of Rows 3 | Number of Power or Coaxial Positions 64 | Number of Signal Positions 64 | Rows Loaded C | PCB Mount Orientation Right Angle | Number of Positions 64 | Rows Loaded A | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Base Material Brass | Contact Mating Area Plating Material Thickness .76 MICM |

Body Features: Primary Product Color Gray | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 96 | PCB Mount Orientation Right Angle | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 3 AMP | Dimensions: Row-to-Row Spacing .1 INCH | Row-to-Row Spacing 2.54 MM | Housing Features: Centerline (Pitch) .1 INCH | Housing Material Glass Filled Polyester | Centerline (Pitch) 2.54 MM | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Ap

Body Features: Primary Product Color Gray | Configuration Features: Number of Positions 96 | PCB Mount Orientation Vertical | Rows Loaded A | Number of Signal Positions 96 | Number of Columns 32 | Rows Loaded B | Number of Rows 3 | Number of Power or Coaxial Positions 96 | Rows Loaded C | Contact Features: Contact Base Material Brass | PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1.5 AMP |

Contact Features: Barrel Type Closed | Contact Current Rating (Max) 50 AMP | Mating Tab Thickness 3.35 MM | Contact Base Material Copper Alloy | Contact Underplating Material Thickness 1.27 MICIN | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Mating Area Plating Material Silver | Mating Tab Thickness .131 INCH | Wire Contact Termination Area Plating Material Silver | Contact Underplating Material Nickel | Contact Orientation Straight | Wire Contact Termination Area Plating Material Fin

Configuration Features: Number of Signal Positions 0 | Number of Positions 2 | Number of Power Positions 0 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Type Tab | Dimensions: Wire Size 12 – 6 AWG | Connector Height 15.88 MM | Compatible Insulation Diameter Range 10 MM | Wire Size 3.085 – 14 MMSQ | Product Length 1.9 INCH | Product Length 48.23 MM | Compatible Insulation Diameter Range .394 INCH | Wire Size 6088 – 27629 CMA | Product Width 1.38 INCH | Connec

Body Features: Connector Profile Low | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Mating Post Length .33 INCH | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 7.5 AMP | Mating Post Length 8.6 MM | Contact Layout Inline | Contact Type Pin | Contact Base Material Brass | PCB Contact Termi

Body Features: Connector Profile Low | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Mating Post Length .33 INCH | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | PCB Contact T

Body Features: Connector Profile Low | Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Base Material Brass | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | PCB Contact T

Body Features: Connector Profile Low | Configuration Features: PCB Mount Orientation Vertical | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Mating Post Length 8.6 MM | Contact Base Material Brass | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inli

Body Features: Connector Profile Low | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Current Rating (Max) 7.5 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Base Material Brass |

Use the download button to access the 6469083-1 schematic symbol, PCB footprint, and 3D model.

TE Connectivity HM Series 2mm 200 Way 8 Row Right Angle PCB Socket Through Hole Free Board

TE Connectivity HM Series, 2mm Pitch 176 Way 8 Row Straight PCB Header, Through Hole Termination

Configuration Features: Number of Power Positions 2 | Number of Signal Positions 24 | PCB Mount Orientation Right Angle | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Materi

Configuration Features: Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 100 MICIN | Mating Post Length 10.16 MM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 7 AMP | Contact Base Material Copper Alloy | Contact Layout Inline | Contact

Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Copper Alloy | Contact Layout Inline | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Mating Post Length 10.16 MM | Contact Current Rating (Max) 7 AMP | Mating Post Length .4 IN

Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material

Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material

Configuration Features: PCB Mount Orientation Vertical | Number of Positions 15 | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Layout Matrix | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Tin | Mult

Configuration Features: Number of Rows 3 | Number of Signal Positions 0 | Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | Contact Type Pin | Multiple Contact Types Without | Contact Mating

Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Signal Positions 0 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Pla

Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08

Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Signal Positions 0 | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 â

Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thic

TE Connectivity MTA Series, 2.54mm Pitch 6 Way 1 Row Straight PCB Header, Through Hole Termination, 5A

Body Features: PCB Ground Tab Location .153 INCH | Modular Jack Latch Orientation Inverted - Latch Up | Shield Plating Material Tin | Shield Material Copper Zinc Alloy | PCB Ground Tab Location 3.89 MM | Connector Profile Standard | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Positions 8 | Number of Loaded Positions 8 | Connector Contact Density Standard | Number of PCB Ground Tabs 2 | PCB Mount Orientation Vertical | Status Light Type Not Illuminated | Port Configuration Single Port

Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Socket | Mating Square Post Dimension 1.14 MM | Mating Square Post Dimension .045 INCH | Contact Current Rating (Max) 6.5 AMP | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Pre-Tin | Contact Base Material Brass | Dimensions: Wire Size .2 – .9 MMSQ | Wire Size 24 – 18 AWG | Electrical Characteristics: Operating Voltag

Configuration Features: Number of Power Positions 8 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material

ROHS COMPLIANT

TE Connectivity MTA Series, 2.54mm Pitch 3 Way 1 Row Straight PCB Header, Through Hole Termination, 5A

Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Special Purpose Terminal Type Brush | Terminal Orientation Flag | Terminal Plating Material Unplated | Barrel Type Open | Dimensions: Wire Size 18 – 14 AWG | Wire Size .8 – 2 MMSQ | Terminal Material Thickness .51 MM | Terminal Material Thickness .02 INCH | Product Length 11.05 MM | Product Length .435 INCH | Mechanical Attachment: Wire Insulation Support Without | Packaging Features: Packaging Quantity 3600 | Pa

4PDT PCB Mount Non-Latching Relay Solder, 2 A, 20V dc

Configuration Features: Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 19 AMP | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Wi

Contact Features: Contact Mating Area Plating Material Thickness 15.75 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness .38 MICM | Contact Orientation Straight | Mating Pin Diameter 1.45 MM | Contact Mating Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Fabrication Stamped & Formed | Wire Contact Termination Area Plating Thickness .8 – 2 MICM | Contact Type Pin | Mating Pin Diameter .057 INCH | Contact Current

Contact Features: Contact Orientation Straight | Mating Pin Diameter 1.45 MM | Contact Fabrication Stamped & Formed | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 15.75 MICIN | Wire Contact Termination Area Plating Thickness 31.49 – 78.74 MICIN | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .4 MICM | Mating Pin Diameter .057 INCH | Contact Type Pin | Contact Current Rati

Configuration Features: Number of Power Positions 0 | Number of Signal Positions 9 | PCB Mount Orientation Vertical | Number of Positions 9 | Number of Columns 3 | Number of Rows 3 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material T