TE Connectivity

TE Connectivity SMW Series Wire Wound High Power Surface Mount Resistor 10Ω ±5% 5W ±200ppm/°C

Body Features: Primary Product Color Natural | Configuration Features: PCB Mount Orientation Vertical | Number of Columns 5 | Backplane Architecture Traditional Backplane | Number of Positions 5 | Contact Features: CompactPCI Designation None | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness 50 MICIN | Housing Features: Centerline (Pitch) 3 MM | Centerline (Pitch) .118 INCH | Mechanica

Body Features: Connector Profile Standard | Shell Plating Material Tin | Shell Plating Finish Matte | Configuration Features: PCB Mount Orientation Right Angle | Panel Ground Location Top | Number of Ports 1 | Number of Positions 19 | Stacked No | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 11.81 MICIN | Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .3 MICM | Dimensions: PCB Thickness (Min) .063 INCH | PC

Body Features: Primary Product Color Green | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 14 | Number of Rows 2 | PCB Mount Orientation Vertical | Board-to-Board Configuration Parallel | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Square | Contact Mating Area Plating Material Thickness 3 MICM | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plating Material Thickness 2 MICM | Contact Current

Body Features: Primary Product Color Green | Configuration Features: Connector Contact Load Condition Fully Loaded | PCB Mount Orientation Vertical | Number of Rows 1 | Board-to-Board Configuration Parallel | Number of Positions 2 | Contact Features: Mating Square Post Dimension .025 INCH | Contact Current Rating (Max) 5 AMP | Contact Shape & Form Square | PCB Contact Termination Area Plating Material Thickness 2 MICM | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Ma

Body Features: Primary Product Color Green | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 6 | Connector Contact Load Condition Fully Loaded | Board-to-Board Configuration Parallel | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 5 AMP | Mating Square Post Dimension .63 MM | Contact Shape & Form Square | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 118.11 MICIN | PCB Contact Termination Area Plating Material Thick

Headers & Wire Housings 08 MODII HDR SRRA B/A W/HLDWN LF

Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .381 MICM | Contact Mating Area Plating Material Finish Bright | PCB Contact Termination Area Plating Material Thickness 2.5 MICM | Contact Mating A

Board to Board & Mezzanine Connectors R.A. RECPT 50P Series I hi-temp

Body Features: Primary Product Color Green | Configuration Features: Board-to-Board Configuration Parallel | Number of Positions 3 | PCB Mount Orientation Vertical | Number of Rows 1 | Connector Contact Load Condition Fully Loaded | Contact Features: Contact Base Material Phosphor Bronze | Mating Square Post Dimension .63 MM | Contact Type Pin | Contact Mating Area Plating Material Thickness 31.5 MICIN | Contact Shape & Form Square | Mating Square Post Dimension .025 INCH | PCB Contact Termination Area Plat

Body Features: Connector Profile Low | Primary Product Color Black | Daisy Chain With | Configuration Features: Number of Rows 2 | Number of Positions 34 | PCB Mount Orientation Vertical | Contact Features: Mating Pin Diameter .64 MM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .762 MICM | Contact Base Material Phosphor Bronze | PCB Contact Terminat

WIRE-BOARD CONN, HEADER, 34POS

Headers & Wire Housings 2P SINGLE ROW

Use the download button to access the 1-2199299-2 schematic symbol, PCB footprint, and 3D model.

Body Features: Primary Product Color Black | Configuration Features: Number of Positions 12 | PCB Mount Orientation Vertical | Connector Contact Load Condition Fully Loaded | Number of Rows 2 | Board-to-Board Configuration Parallel | Contact Features: Contact Mating Area Plating Material Thickness .8 MICM | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Zinc | Mating Square Post Dimension .64 MM | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3

EIA STD PACKAGE SIZE 0805, 2 PIN

Type BMB-L Series 0.30 ohms resistance 350mA Current

Configuration Features: Number of Power Positions 7 | Number of Rows 1 | Number of Positions 7 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 7 AMP | Contact Retention Within Housing Without | PCB Contact Termination Area

Configuration Features: Number of Rows 1 | Number of Positions 3 | Number of Power Positions 3 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Mating Post Length 10.16 MM | Contact Layout Inline | Mating Post Length .4 INCH | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Mate

2way straight header tin single row TE Connectivity AMPMODU Mod I Series, 3.96mm Pitch 2 Way 1 Row Shrouded Straight PCB Header, Through Hole

Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Positions 2 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Layout Inline | Mating Post Length 10.16 MM | Mating Post Length .4 INCH | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Contac

Use the download button to access the 5-1775333-4 schematic symbol, PCB footprint, and 3D model.

Body Features: Shell Plating Finish Bright | Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Positions 8 | Number of Ports 2 | Panel Ground Location Between Ports | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.57 MM |

Body Features: Shell Plating Finish Bright | Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Ports 2 | Number of Positions 8 | Panel Ground Location Between Ports | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM |

Body Features: Offset 0 MM | Connector Profile Standard | Shell Plating Material Nickel over Copper | Configuration Features: Number of Ports 1 | Panel Ground Location Right/Left | Number of Positions 4 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) .039 INCH | PCB Thick

Body Features: Shell Plating Material Tin | Connector Profile Standard | Shell Plating Finish Bright | Configuration Features: Number of Mounting Legs 2 | Number of Positions 9 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1.8 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Dimensions: PCB Thickness (Recommended) 1.6 MM | PCB Thic

Recept pcb smt r/a USB type A TE Connectivity Female Right Angle SMT Type A USB Connector

Use the download button to access the 1-2007492-5 schematic symbol, PCB footprint, and 3D model.

High Speed / Modular Connectors Z-PACK SLIM UHD HIGH SPD 12C 8R VERT PLUG

Use the download button to access the 1-2199298-3 schematic symbol, PCB footprint, and 3D model.

TE CONNECTIVITY - 1-2199298-2 - IC SOCKET, DIP, 8POS, TH

Body Features: Offset 0 MM | Connector Profile Mini | Shell Plating Material Nickel | Configuration Features: Number of Positions 5 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommended) .062 INCH | Housing Features: Hous

8 Way Through Hole DIP Switch SPST, Extended Slide Actuator

10P Micro-MaTch Female 1.27mm

Body Features: PCB Ground Tab Location 3.89 MM | Connector Profile Standard | Modular Jack Latch Orientation Inverted - Latch Up | Shield Plating Material Tin | Shield Material Copper Zinc Alloy | PCB Ground Tab Location .153 INCH | Configuration Features: Connector Contact Density Standard | Number of Positions 8 | Status Light Type Not Illuminated | Port Configuration Single Port | PCB Mount Orientation Vertical | Number of PCB Ground Tabs 2 | Port Matrix Configuration 1 x 1 | Number of Loaded Positions 8

12P Micro-MaTch Female 1.27mm T/Hole TE Connectivity Micro-Match Series 1.72mm Pitch 12 Way 2 Row Straight PCB Socket, Through Hole, Solder Termination

Connector RJ22 Jack 1 port 4P4C TE Connectivity 4P4C Right Angle PCB Mount Unshielded RJ22 Modular Jack Connector

Modular Connectors / Ethernet Connectors MOD JACK, RJ45, SHIELD,50u Au, L=2.05mm

Body Features: Primary Product Color Natural | Configuration Features: Number of Positions 2 | Number of Columns 2 | PCB Mount Orientation Vertical | Number of Rows 1 | Contact Features: Contact Mating Area Length 7.49 MM | Contact Shape & Form Square | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 150 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Length .295 INCH | PCB Contact Termination A

Mod Jack RJ45 Cat 5e PCB Mount

Contact Features: PCB Terminal Type Tab | Contact Underplating Material Copper or Nickel | Terminal Plating Material Tin | Terminal Size 6.35 | Contact Underplating Material Thickness 100 MICIN | Mating Tab Width 6.35 MM | Mating Tab Width .25 INCH | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 3.81 MICM | Contact Underplating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 150 MICIN | Mating Tab Thickness .0

Blue Button Tactile Switch, SPST 50 mA@ 24 V dc 3.4mm

Use the download button to access the 1-1241150-2 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 1-1337541-0 schematic symbol, PCB footprint, and 3D model.

Body Features: Connector Profile Standard | Shell Plating Finish Bright | Shell Plating Material Tin | Configuration Features: Number of Ports 1 | Number of Positions 4 | Number of Mounting Legs 2 | Contact Features: Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thick

Body Features: Modular Jack Latch Orientation Standard - Latch Down | Configuration Features: EMI Finger Location Sides | EMI Finger Location Bottom | Number of Loaded Positions 8 | Status Light Type Lightpipe | Port Configuration Multiple Ports | Multiple Port Configuration Ganged | Number of Positions 8 | Port Matrix Configuration 1 x 2 | PCB Mount Orientation Right Angle | Connector Contact Density High | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Current Rating (Max) .02 AMP | Housin

Use the download button to access the 1-1337445-0 schematic symbol, PCB footprint, and 3D model.

General Purpose Signal Relay, DC, Polarized, Monostable, 2 Form C DPDT-CO, 5 A Contact Rating, 24 VDC Coil Voltage, 250 VAC Contact Voltage, Axicom IM

Body Features: Connector Profile Low | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location -3.05 MM | Shield Plating Material Tin | Shield Material Copper Alloy | PCB Ground Tab Location -.12 INCH | Configuration Features: Port Configuration Single Port | Number of PCB Ground Tabs 2 | Status Light Type Not Illuminated | Number of Positions 10 | Port Matrix Configuration 1 x 1 | Panel Ground Location Top/Bottom | Connector Contact Density Standard | PCB Mount Orientation Right Angl

Body Features: Shield Plating Material Tin over Nickel | Shield Plating Finish Bright | Panel Ground Feature Type None | Shield Material Copper Alloy | Shield Plating Thickness 59 MICIN | Primary Product Color Black | Configuration Features: Number of Positions 8 | Connector Contact Load Condition Fully Loaded | PCB Mount Orientation Right Angle | Contact Features: Contact Shape & Form Tuning Fork | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Thickness 170 MICIN | PCB