TLV70033 LDO Family Guide: Pinout, Variants (DBVR / DCKR / DDCR / DSER), and Application Circuits

If you're searching for the TLV70033DBVR and getting confusing distributor results, you're not alone — but the part you actually want is almost certainly the TLV70033DDCR (SOT-23-5) or TLV70033DCKR (SC70-5). The "DBVR" suffix that shows up in BOMs and search queries is a common naming-convention mix-up: TI uses "DBV" for SOT-23-5 packaging on other product families (like the OPA, REF, and TLV431 lines), but the TLV70033 LDO uses the DDC suffix for SOT-23-5 instead. This article walks through the full TLV70033 200 mA, 3.3 V LDO family, explains every package suffix, and gives you the application-circuit basics so you pick the right variant the first time.

By the end, you'll know which package to specify, what input/output capacitors to pair with it, and where the typical layout traps are.

What You Need

• A 3.3 V rail decision: are you regulating from a 3.7 V Li-ion, a 5 V USB rail, or a discharging coin cell?
• Maximum load current — the TLV70033 caps at 200 mA; if you need more, look at the TLV713 or LP5907-1A class.
• Board area constraint — this is what selects between SC70-5, SOT-23-5, and X2SON-6.
• Noise budget — for ADC references and RF front-ends, the family's 38 µV_RMS noise figure matters.

TLV70033 Family Variants Decoded

The TLV70033 is a 200 mA, 3.3 V fixed-output LDO from Texas Instruments with ~31 µA quiescent current and 175 mV typical dropout at full load. The "70033" trailing digits encode the output voltage (3.3 V); the suffix encodes packaging:

Part Number	Package	Footprint	Tape & Reel	Best For
TLV70033DCKR	SC70-5	2.0 × 1.25 mm	3,000 / reel	Wearables, smallest leaded SMT
TLV70033DCKT	SC70-5	2.0 × 1.25 mm	250 / cut tape	Prototyping with SC70
TLV70033DDCR	SOT-23-5	2.9 × 1.6 mm	3,000 / reel	Mainstream — easy hand-solder, common footprint
TLV70033DDCT	SOT-23-5	2.9 × 1.6 mm	250 / cut tape	Prototyping with SOT-23
TLV70033DSER	X2SON-6	1.0 × 1.0 mm	3,000 / reel	Hearables, smartwatch sensor modules
TLV70033DSET	X2SON-6	1.0 × 1.0 mm	250 / cut tape	X2SON prototyping

The "TLV70033DBVR" suffix does not exist as a TI orderable — but if a customer hands you that BOM line, the substitution that almost always satisfies their intent is TLV70033DDCR (the SOT-23-5 in tape-and-reel). Validate with the customer before substituting on a paid build.

For other output voltages in the same body, TI offers the TLV70030 (3.0 V), TLV70025 (2.5 V), TLV70019 (1.9 V), TLV70018 (1.8 V), TLV70015 (1.5 V), and TLV70012 (1.2 V) — all pin-compatible across packages. See TLV70030DDCT for the most common 3.0 V variant.

Pinout (5-Pin Variants)

For the SC70-5 (DCK) and SOT-23-5 (DDC) packages, the pinout is identical:

Pin	Name	Function
1	IN	Input voltage (2.0 – 5.5 V)
2	GND	Ground
3	EN	Enable (active high; tie to IN to keep always on)
4	NC	No connect
5	OUT	Regulated 3.3 V output, up to 200 mA

The X2SON-6 (DSE) package adds a sixth pin (NC) for symmetry and easier solder-paste alignment. Functionally it is identical.

Step-by-Step: Designing With the TLV70033

Step 1 — Confirm Your Input Rail

Verify your input is between 2.0 V and 5.5 V. Common rails that work:

• 3.7 V Li-ion nominal (3.0 – 4.2 V range): ✅
• 5.0 V USB rail: ✅
• 3.0 V CR2032 coin cell (declining to ~2.4 V at end-of-life): ✅, but with shrinking dropout headroom
• 12 V automotive: ❌ — exceeds the 5.5 V Vin max; use a buck pre-regulator

The dropout voltage is 175 mV typical at 200 mA load, so to maintain regulated 3.3 V output, your input must stay above 3.475 V at full load. For lighter loads (1–10 mA), dropout falls below 30 mV.

Step 2 — Pick the Package

Use the table above. Hand-soldering favors SOT-23-5 (DDCR/DDCT). Pick-and-place lines on micro-PCBs favor X2SON-6 (DSER/DSET) because of the smaller footprint and lower placement cost per unit area. For prototypes, the cut-tape (T) variants ship in quantities of 250 — useful when you don't want to buy a 3,000-piece reel.

Step 3 — Specify Input and Output Capacitors

The TLV70033 is stable with 1 µF ceramic input and 1 µF ceramic output capacitors. Both should be X5R or X7R dielectric, rated at least 2× your operating voltage to compensate for the DC-bias capacitance derating that ceramic capacitors exhibit:

• 5 V input rail → use 10 V-rated 1 µF X5R 0402 or 0603
• 3.3 V output → use 6.3 V-rated 1 µF X5R 0402 or 0603

A common mistake is specifying a 6.3 V-rated 0402 on a 5 V rail — its actual capacitance at 5 V can drop to 0.4 µF, which can cause stability issues. When in doubt, simulate with the manufacturer's DC-bias data or step up to 10 V or 16 V parts.

Step 4 — Handle the EN Pin

The EN pin is logic-level active-high with a 0.9 V typical threshold. Three common configurations:

• Always on: tie EN directly to IN. Simplest, but you pay 31 µA quiescent current 24/7.
• MCU-controlled: drive EN from a GPIO; Q current drops to ~150 nA when disabled.
• Power sequencing: drive EN from a power-good signal of an upstream regulator to enforce ordering.

Do not leave EN floating — it has no internal pull-down.

Step 5 — Layout

Three rules cover most TLV70033 layouts:

1. Input cap within 5 mm of the IN pin — minimizes loop inductance for fast load transients.
2. Output cap within 5 mm of the OUT pin — same reason.
3. GND pin tied to a solid ground plane via a short trace or a directly-under-pad via — never run a thin trace from the LDO ground to a distant ground point; switching transients on the load side will corrupt the regulator's reference.

For battery-powered designs where ESR matters, place the output capacitor directly adjacent to the load decoupling caps so they share the same ground island.

Application Circuits

Battery-Powered MCU (Coin Cell → 3.3 V MCU)

CR2032 → 1 µF input cap → TLV70033DCKR (SC70-5) → 1 µF output cap → MCU VDD. EN tied to IN. With a 1 µA average MCU current and 31 µA LDO quiescent, expected coin-cell life is dominated by the LDO's quiescent draw — for sub-µA designs, look at the TLV713 series instead.

Clean ADC Reference Rail

For 12-bit ADCs that share a noisy main 3.3 V rail, post-regulate with TLV70033 and a larger 4.7 µF output capacitor for additional high-frequency rolloff. The 38 µV_RMS noise floor (10 Hz – 100 kHz) keeps you below the LSB of a 3.3 V/4096 = 805 µV step.

For higher-precision ADC reference designs (16-bit and above), step up to a dedicated voltage reference like the REF2030AIDDCR which provides 30 ppm/°C accuracy at the cost of lower current capability.

Wearable Sensor Module (X2SON-6)

For wrist-worn pulse oximeters and CGM patches, the X2SON-6 footprint shaves ~5 mm² vs SOT-23-5. Pair the TLV70033DSER with 0402 ceramic caps on a 4-layer board with the LDO directly over an inner ground plane.

Common Mistakes

1. Specifying "TLV70033DBVR" on a BOM — does not exist. Customer almost always means TLV70033DDCR. Confirm before quoting or substituting on a build.
2. Using under-derated ceramic caps — DC-bias derating turns a nominal 1 µF cap into 0.4 µF on a 5 V rail. Always specify capacitors rated 2× operating voltage minimum.
3. Floating EN pin — causes intermittent startup. Always tie to IN or to an MCU GPIO with a defined state.
4. Expecting a regulated rail at >5.5 V input — the input pin will clamp and the part will fail. Use a buck pre-regulator for higher input voltages.
5. Long trace from GND pin to ground plane — corrupts the regulator's internal reference under load steps. Use a via-in-pad or place GND pin directly over a ground island.

FAQ

Is TLV70033DBVR a real Texas Instruments part? No. TI's TLV70033 family uses the DCK (SC70-5), DDC (SOT-23-5), and DSE (X2SON-6) package codes. The "DBV" code is used for SOT-23-5 on other TI families (op-amps, voltage references, TLV431 shunt regulator) but not on the TLV70033. If you see "TLV70033DBVR" on a BOM or quote, the intended part is almost certainly TLV70033DDCR.

What's the difference between TLV70033DCKR and TLV70033DDCT? The DCKR is SC70-5 (2.0 × 1.25 mm, 3,000-piece reel) — smaller, harder to hand-solder. The DDCT is SOT-23-5 (2.9 × 1.6 mm, 250-piece cut tape) — easier to assemble by hand, ideal for prototypes. Electrically they are identical.

TLV70033 vs LP5907 — which should I pick? The LP5907 has lower noise (6.5 µV_RMS vs 38 µV_RMS) and slightly higher PSRR — choose it when driving sensitive analog or RF supply rails. The TLV70033 has lower quiescent current (31 µA vs 12 µA — close but the TLV70033 is more battery-friendly with light loads) and is easier to source. For most digital MCU power, the TLV70033 is the cost-effective choice.

What's the smallest TLV70033 package available? The X2SON-6 (DSER / DSET suffix) at 1.0 × 1.0 mm. It is the smallest production package and is preferred for hearables, smartwatches, and biosensor patches where every square millimeter counts.

Summary and Sourcing

The TLV70033 family is TI's go-to 200 mA, 3.3 V LDO for battery-powered and coin-cell-class designs. The right variant depends almost entirely on your package constraint — DDCR for general use, DCKR for compact wearable boards, DSER for the smallest possible footprint. The "DBVR" suffix is a naming-convention trap; it is not a real orderable part.

If you are building a production BOM and need pricing or live availability across the TLV70033 family, submit an RFQ on FindMyChip — we'll cross-check 200+ verified distributors and return ranked sourcing options within 24 hours, with 5-point authentication on every shipment. For broader power-management sourcing context, see our switching voltage regulator selection guide.